5SGXEA3H3F35C2N

The 5SGXEA3H3F35C2N is a Stratix V GX Field Programmable Gate Array (FPGA) IC supplied in a 1152-ball FCBGA package. It provides a high logic capacity with on-chip RAM and a broad I/O count to support complex, programmable digital systems.

Built for commercial temperature applications, this surface-mount FPGA combines approximately 340,000 logic elements, roughly 19.5 Mbits of embedded memory, and 432 user I/Os, making it suitable for designs that require substantial on-chip resources and dense integration.

Key Features

• Logic Capacity  Approximately 340,000 logic elements to implement large-scale programmable logic and custom digital functions.
• Embedded Memory  Approximately 19.5 Mbits of on-chip RAM for buffering, tables, and state storage within the FPGA fabric.
• I/O Resources  432 user I/O pins to support wide parallel interfaces and multiple peripheral connections.
• Power Supply Range  Core supply specified from 870 mV to 930 mV, providing the defined operating window for the device core.
• Package and Mounting  1152-ball FCBGA (1152-FBGA, 35 × 35) surface-mount package for high-density board integration.
• Commercial Temperature Grade  Rated for operation from 0 °C to 85 °C, aligned with commercial-grade system requirements.
• Environmental Compliance  RoHS-compliant to meet common lead-free assembly and environmental requirements.

Typical Applications

• High-density logic systems  Use the large logic-element count and embedded memory to implement complex FPGA-based controllers and state machines.
• Data buffering and on-chip storage  Leverage approximately 19.5 Mbits of RAM for packet buffering, FIFO implementations, and temporary data storage.
• Parallel interface aggregation  432 I/Os enable aggregation of multiple parallel busses, wide data paths, or mixed-signal front-end interfacing on a single device.

Unique Advantages

• Large programmable capacity: Approximately 340,000 logic elements provide the headroom required for complex designs without immediate migration to multiple devices.
• Significant embedded memory: Nearly 19.5 Mbits of on-chip RAM reduces external memory dependency for many buffering and table storage needs.
• High I/O count: 432 user I/Os simplify board-level routing for multi-channel or wide-data applications, minimizing glue logic.
• Compact, high-density package: 1152-ball FCBGA (35 × 35) delivers dense integration for space-constrained PCBs while supporting surface-mount assembly.
• Commercial-grade operating range: Specified 0 °C to 85 °C temperature range and RoHS compliance align with common commercial production environments.

Why Choose 5SGXEA3H3F35C2N?

The 5SGXEA3H3F35C2N combines a high logic element count with substantial embedded RAM and a large I/O complement in a compact FCBGA package, delivering a balanced platform for demanding, high-density FPGA designs within commercial temperature environments. Its specification set supports designs that require integrated memory, broad interfacing capability, and significant programmable resources.

This part is suited for teams and projects that need on-chip capacity and integration to reduce external components and streamline board-level architecture while maintaining compliance with RoHS requirements.

Request a quote or submit an inquiry to obtain pricing, availability, and further procurement details for 5SGXEA3H3F35C2N.