5SGXEA3H3F35C3N

The 5SGXEA3H3F35C3N is a Stratix® V GX field programmable gate array (FPGA) in a 1152-BBGA FCBGA package. It provides a high-density programmable logic fabric with substantial embedded memory and a large number of I/O for commercial-grade applications.

With approximately 340,000 logic elements, around 128,300 logic blocks, and approximately 19.456 Mbits of on-chip RAM, this device targets designs that require considerable logic capacity, significant embedded memory, and extensive external connectivity while operating within a commercial temperature range.

Key Features

• Logic Capacity  Approximately 340,000 logic elements and about 128,300 logic blocks provide high-density programmable logic for complex functions.
• Embedded Memory  Approximately 19.456 Mbits of on-chip RAM to support large buffers, FIFOs, and data storage inside the FPGA fabric.
• I/O Count  432 user I/O pins to support broad connectivity requirements and multiple external interfaces.
• Package  1152-BBGA FCBGA (supplier package listed as 1152-FBGA, 35×35) for a high-pin-count, compact footprint suitable for surface-mount assembly.
• Powering  Core voltage supply range from 820 mV to 880 mV for the device core domain.
• Temperature Grade  Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Mounting  Surface-mount device (SMD) for board-level integration.
• Compliance  RoHS compliant.
• Family Documentation  Part of the Stratix V GX device family; electrical and switching characteristics are documented in the Stratix V device datasheet.

Typical Applications

• High-density programmable logic  Implement complex digital functions and custom datapaths using the device’s large logic element count and logic block resources.
• Memory-intensive designs  Leverage approximately 19.456 Mbits of embedded RAM for buffering, packet processing, and streaming data applications.
• Connectivity-heavy systems  Use the 432 I/O pins to interface with multiple external devices, peripherals, and high-pin-count subsystems.

Unique Advantages

• High logic density:  Approximately 340,000 logic elements enable implementation of large, complex designs on a single device.
• Substantial on-chip memory:  Around 19.456 Mbits of embedded RAM reduces reliance on external memory for many buffering and storage tasks.
• Extensive I/O availability:  432 I/Os support broad system interfacing without immediate need for external I/O expanders.
• Compact, high-pin-count package:  1152-BBGA (35×35) FCBGA package provides a dense pinout suitable for complex board-level routing while keeping a compact footprint.
• Low-voltage core operation:  Core supply range of 820 mV–880 mV aligns with modern low-voltage FPGA power domains.
• Commercial temperature rating:  Rated 0 °C to 85 °C for standard commercial applications.

Why Choose 5SGXEA3H3F35C3N?

The 5SGXEA3H3F35C3N delivers a combination of high logic capacity, significant embedded memory, and extensive I/O in a compact 1152-BBGA FCBGA package, making it well suited to commercial designs that require dense programmable logic and on-chip storage. Its core voltage and operating temperature specifications provide clear engineering constraints for system power and thermal design.

As a Stratix V GX family device, it is specified with detailed electrical and switching characteristics in the Stratix V documentation, allowing engineers to plan timing, power, and I/O integration based on published device parameters.

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