5SGXEA3H3F35C2LG
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 432 19456000 340000 1152-BBGA, FCBGA |
|---|---|
| Quantity | 996 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FBGA (35x35) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 432 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 128300 | Number of Logic Elements/Cells | 340000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 19456000 |
Overview of 5SGXEA3H3F35C2LG – Stratix® V GX FPGA, 340,000 logic elements, 432 I/O, 1152-BBGA
The Intel Stratix® V GX FPGA 5SGXEA3H3F35C2LG is a commercial-grade field-programmable gate array in the Stratix V family. It integrates 340,000 logic elements, approximately 19.456 Mbits of on-chip RAM, and 432 user I/O in a 1152‑BBGA (35 × 35) FCBGA package.
Built for designs that require high logic capacity, substantial embedded memory, and a large I/O count, this device is supplied for surface-mount assembly and is RoHS compliant.
Key Features
- Core Logic 340,000 logic elements provide high-density programmable logic resources for complex designs.
- Embedded Memory Approximately 19.456 Mbits of total on-chip RAM to support large buffers, FIFOs, and memory-intensive logic.
- I/O Capacity 432 user I/O pins to support wide parallel buses, multiple interfaces, and dense board-level connectivity.
- Package & Mounting 1152‑BBGA FCBGA package (supplier package: 1152‑FBGA, 35 × 35) with surface-mount mounting for compact board integration.
- Power Core voltage supply range: 820 mV to 880 mV, enabling defined power budgeting for system design.
- Operating Grade & Temperature Commercial grade with an operating temperature range of 0 °C to 85 °C.
- Standards RoHS compliant, meeting common environmental and material requirements.
Unique Advantages
- High logic density: 340,000 logic elements enable integration of complex functions on a single device, reducing external component count.
- Significant on-chip memory: Approximately 19.456 Mbits of RAM supports larger datasets and buffering without relying on external memory.
- Extensive I/O: 432 I/O pins allow flexible system interfacing and support for multiple peripherals or bus architectures.
- Compact FCBGA package: 1152‑BBGA (35 × 35) balances pin count and board footprint for high-density applications.
- Commercial temperature grade: Rated 0 °C to 85 °C for a wide range of commercial and industrial-adjacent deployments.
- RoHS compliant: Meets regulatory requirements for lead-free and environmentally conscious designs.
Why Choose 5SGXEA3H3F35C2LG?
This Stratix V GX FPGA SKU combines large programmable logic capacity, substantial embedded memory, and a high I/O count in a compact 1152‑BBGA FCBGA package. The device is targeted at designs that need integrated, high-density programmable resources while maintaining a defined commercial operating profile and RoHS compliance.
Developers and procurement teams looking for a commercially graded Stratix V GX device with clear power and thermal parameters will find 5SGXEA3H3F35C2LG suitable for applications demanding significant on-chip resources and dense board integration.
Request a quote or submit an inquiry to obtain pricing, availability, and delivery information for 5SGXEA3H3F35C2LG.

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