5SGXEA3H3F35C2LG

IC FPGA 432 I/O 1152FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 432 19456000 340000 1152-BBGA, FCBGA

Quantity 996 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1152-BBGA, FCBGANumber of I/O432Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs128300Number of Logic Elements/Cells340000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits19456000

Overview of 5SGXEA3H3F35C2LG – Stratix® V GX FPGA, 340,000 logic elements, 432 I/O, 1152-BBGA

The Intel Stratix® V GX FPGA 5SGXEA3H3F35C2LG is a commercial-grade field-programmable gate array in the Stratix V family. It integrates 340,000 logic elements, approximately 19.456 Mbits of on-chip RAM, and 432 user I/O in a 1152‑BBGA (35 × 35) FCBGA package.

Built for designs that require high logic capacity, substantial embedded memory, and a large I/O count, this device is supplied for surface-mount assembly and is RoHS compliant.

Key Features

  • Core Logic  340,000 logic elements provide high-density programmable logic resources for complex designs.
  • Embedded Memory  Approximately 19.456 Mbits of total on-chip RAM to support large buffers, FIFOs, and memory-intensive logic.
  • I/O Capacity  432 user I/O pins to support wide parallel buses, multiple interfaces, and dense board-level connectivity.
  • Package & Mounting  1152‑BBGA FCBGA package (supplier package: 1152‑FBGA, 35 × 35) with surface-mount mounting for compact board integration.
  • Power  Core voltage supply range: 820 mV to 880 mV, enabling defined power budgeting for system design.
  • Operating Grade & Temperature  Commercial grade with an operating temperature range of 0 °C to 85 °C.
  • Standards  RoHS compliant, meeting common environmental and material requirements.

Unique Advantages

  • High logic density: 340,000 logic elements enable integration of complex functions on a single device, reducing external component count.
  • Significant on-chip memory: Approximately 19.456 Mbits of RAM supports larger datasets and buffering without relying on external memory.
  • Extensive I/O: 432 I/O pins allow flexible system interfacing and support for multiple peripherals or bus architectures.
  • Compact FCBGA package: 1152‑BBGA (35 × 35) balances pin count and board footprint for high-density applications.
  • Commercial temperature grade: Rated 0 °C to 85 °C for a wide range of commercial and industrial-adjacent deployments.
  • RoHS compliant: Meets regulatory requirements for lead-free and environmentally conscious designs.

Why Choose 5SGXEA3H3F35C2LG?

This Stratix V GX FPGA SKU combines large programmable logic capacity, substantial embedded memory, and a high I/O count in a compact 1152‑BBGA FCBGA package. The device is targeted at designs that need integrated, high-density programmable resources while maintaining a defined commercial operating profile and RoHS compliance.

Developers and procurement teams looking for a commercially graded Stratix V GX device with clear power and thermal parameters will find 5SGXEA3H3F35C2LG suitable for applications demanding significant on-chip resources and dense board integration.

Request a quote or submit an inquiry to obtain pricing, availability, and delivery information for 5SGXEA3H3F35C2LG.

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