5SGXEA3H3F35C3G

The 5SGXEA3H3F35C3G is a Stratix V GX field-programmable gate array (FPGA) from Intel, offered in a commercial temperature grade. It delivers very high logic density and on-chip memory capacity in a 1152-BBGA (35 × 35 mm) FCBGA package for space-efficient board integration.

Designed for high-capacity digital designs and transceiver-capable Stratix V GX systems, this device targets applications that require large logic resources, substantial embedded memory, and a high I/O count while operating from a low-voltage core supply.

Key Features

• Logic Capacity: 340,000 logic elements to support complex digital designs and high-density logic implementation.
• Embedded Memory: Approximately 19.456 Mbits of total RAM bits for large on-chip buffering, FIFOs, and memory-mapped logic.
• I/O Resources: 432 I/O pins to enable broad system interfacing and extensive peripheral connectivity.
• Core Supply Voltage: Operates with a low-voltage core range of 820 mV to 880 mV, consistent with high-performance FPGA core requirements.
• Package & Mounting: 1152-BBGA, FCBGA package (supplier package listed as 1152-FBGA, 35×35) with surface-mount construction for compact PCB designs.
• Operating Temperature: Commercial-grade operation from 0°C to 85°C for standard commercial deployments.
• Standards Compliance: RoHS compliant, supporting environmental and regulatory requirements for lead-free assemblies.

Typical Applications

• High-density digital processing: Large-scale logic implementations and custom processing pipelines that benefit from high logic-element counts and abundant on-chip RAM.
• Multi-gigabit serial systems: Stratix V GX family devices include transceiver-capable options suitable for designs requiring high-speed serial links and protocol bridging.
• System integration and prototyping: Boards and modules that need many I/Os and significant embedded memory to combine multiple subsystems on a single FPGA.

Unique Advantages

• High logic density: 340,000 logic elements provide the headroom for large state machines, DSP pipelines, and custom accelerators.
• Substantial on-chip memory: Approximately 19.456 Mbits of RAM bits reduces dependence on external memory for many buffering and caching needs.
• Extensive I/O count: 432 I/Os simplify integration with peripherals, memory interfaces, and board-level subsystems.
• Compact, manufacturable package: 1152-BBGA FCBGA in a 35×35 format enables dense PCB layouts while supporting surface-mount assembly.
• Low-voltage core operation: 820–880 mV core supply supports contemporary low-voltage FPGA power architectures.
• Commercial temperature qualification: Rated 0°C to 85°C for standard commercial product deployments.

Why Choose 5SGXEA3H3F35C3G?

The 5SGXEA3H3F35C3G combines large logic capacity, significant embedded memory, and a high I/O count in a compact FCBGA package, making it a strong candidate for sophisticated digital systems and transceiver-capable Stratix V GX designs. Its low-voltage core operation and RoHS compliance align with modern power and manufacturing requirements for commercial products.

This part is well suited for design teams that need to consolidate complex functions on a single FPGA—delivering scalability across logic, memory, and I/O while leveraging the Stratix V GX device family characteristics.

Request a quote or submit an inquiry to evaluate 5SGXEA3H3F35C3G for your next high-density FPGA design.