5SGXEA3H3F35C4G

The 5SGXEA3H3F35C4G is a Stratix V GX field programmable gate array (FPGA) IC from Intel, supplied in a 1152‑ball FCBGA package. This device delivers a high count of programmable logic resources, substantial on‑chip RAM, and a large I/O complement for complex, high‑density FPGA designs.

Designed for commercial temperature operation, the device targets applications that require extensive logic capacity, embedded memory, and flexible I/O in a compact surface‑mount package while operating at a core voltage between 820 mV and 880 mV.

Key Features

• High logic capacity  Offers 340,000 logic elements to implement large-scale, highly parallel FPGA designs.
• Embedded memory  Provides approximately 19.46 Mbits of on‑chip RAM for buffering, lookup tables, and data storage.
• Extensive I/O  432 user I/O pins support complex interfacing and multiple parallel external connections.
• Power and core supply  Operates from a core VCC in the range of 820 mV to 880 mV, enabling defined power budgeting for the logic core.
• Package and mounting  1152‑BBGA (FCBGA) surface‑mount package, supplier package listed as 1152‑FBGA (35×35), for dense board integration.
• Commercial temperature grade  Rated for 0 °C to 85 °C operation—specified as a commercial device.
• RoHS compliant  Manufactured in compliance with RoHS environmental requirements.

Typical Applications

• High‑density programmable logic designs  Leverage the large logic element count to implement complex state machines, datapaths, and parallel computations.
• Memory‑intensive embedded functions  Use the substantial on‑chip RAM for buffering, packet storage, or large lookup tables without external memory.
• Multi‑interface systems  The 432 I/Os enable bridging and aggregation of multiple peripheral and high‑pin‑count interfaces on a single device.

Unique Advantages

• High integration density: 340,000 logic elements allow consolidation of large subsystems into a single FPGA, reducing board count and complexity.
• Significant on‑chip RAM: Approximately 19.46 Mbits of embedded memory minimizes dependence on external memory for many designs.
• Large I/O resource: 432 I/Os support extensive external connectivity and parallel interface implementations.
• Compact FCBGA package: The 1152‑ball FCBGA (35×35) package provides a compact footprint for high‑density board layouts.
• Commercial temperature rating: Specified 0 °C to 85 °C operation for deployment in standard commercial environments.
• Standards‑aligned manufacturing: RoHS compliance supports modern assembly and environmental requirements.

Why Choose 5SGXEA3H3F35C4G?

The 5SGXEA3H3F35C4G combines a very large logic element count with substantial embedded RAM and a high I/O count in a single 1152‑ball FCBGA package, offering a balanced platform for complex, high‑density FPGA implementations. Its defined core voltage range and commercial temperature rating make it suitable for designs that require predictable power planning and standard commercial operation.

Engineers seeking to consolidate multiple functions onto a single FPGA will find this device appropriate for designs that prioritize integration, on‑chip memory capacity, and rich I/O availability, backed by Intel's Stratix V family documentation and device characterization.

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