5SGXEA3H3F35I3G

The 5SGXEA3H3F35I3G is a Stratix® V GX field programmable gate array (FPGA) IC specified with 340,000 logic elements, approximately 19.456 Mbits of on‑chip RAM, and 432 user I/O. It is supplied in a 1152‑ball BGA (FCBGA / 1152‑FBGA, 35×35) surface‑mount package and is offered in an industrial temperature grade.

This device is intended for designs that require large programmable logic capacity, substantial embedded memory, and high I/O density while operating across an industrial temperature range. Core supply is specified between 820 mV and 880 mV.

Key Features

• Logic Capacity  Approximately 340,000 logic elements suitable for large-scale programmable logic integration.
• Embedded Memory  Approximately 19.456 Mbits of on‑chip RAM to support buffering, state storage, and memory‑intensive logic functions.
• I/O Density  432 user I/O pins for extensive interfacing and parallel connectivity.
• Package & Mounting  1152‑BBGA, FCBGA package (supplier package: 1152‑FBGA, 35×35) with surface‑mount mounting for compact, high‑pin‑count board designs.
• Power Supply  Core voltage specified from 820 mV to 880 mV for integration into low‑voltage power architectures.
• Temperature Grade  Industrial operating temperature range: −40 °C to 100 °C for use in temperature‑sensitive environments.
• Environmental Compliance  RoHS compliant.

Typical Applications

• High-density programmable logic  Large logic capacity and on‑chip RAM enable complex, consolidated digital designs.
• I/O‑intensive systems  432 I/O pins support boards that require broad parallel connectivity or plentiful external interfaces.
• Industrial electronics  Industrial temperature rating (−40 °C to 100 °C) makes the device suitable for embedded systems operating across wide temperature ranges.

Unique Advantages

• Large integrated logic and memory: Reduces dependence on multiple external components by providing substantial on‑chip resources.
• High I/O count: Simplifies board-level routing and reduces the need for external I/O expanders in complex interface applications.
• Industrial temperature capability: Supports deployment in environments with wide temperature swings.
• Compact high‑ball‑count package: 1152‑BBGA FCBGA footprint delivers high pin count in a compact surface‑mount package.
• Defined low‑voltage core range: Core supply of 820–880 mV aligns with low‑voltage FPGA power architectures.
• Standards compliance: RoHS compliance for environmental and supply‑chain requirements.

Why Choose 5SGXEA3H3F35I3G?

The 5SGXEA3H3F35I3G provides a balanced combination of large logic capacity, substantial embedded RAM, and extensive I/O in a compact 1152‑BBGA surface‑mount package. Its industrial temperature rating and defined core voltage range make it suitable for embedded and industrial designs that require robust operation across a wide temperature window.

This part is well suited to engineers and procurement teams seeking a high‑capacity Stratix® V GX FPGA with clear, verifiable specifications for logic resources, memory, I/O count, package type, and environmental compliance.

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