5SGXEA3H3F35I3N

The 5SGXEA3H3F35I3N is a Stratix® V GX field programmable gate array (FPGA) in an industrial temperature grade. It delivers a high logic capacity and substantial on-chip memory in a 1152‑ball FCBGA package for dense, surface‑mount system designs.

As part of the Stratix V GX family, series documentation describes configurable high‑speed transceiver support and multiple core/transceiver speed grades. This part targets applications that require large programmable logic resources, many I/O, and operation across an extended industrial temperature range.

Key Features

• Core Logic  340,000 logic elements (LEs) to implement complex programmable logic, state machines, and custom datapaths.
• Embedded Memory  Approximately 19.456 Mbits of on‑chip RAM for buffering, FIFOs, and scratchpad storage.
• I/O Density  432 general‑purpose I/O pins to support wide parallel interfaces and multi‑lane connectivity.
• Package  1152‑BBGA (FCBGA), supplier package 1152‑FBGA (35×35), surface‑mount mounting for compact, high‑density PCB integration.
• Power  Core supply range 820 mV to 880 mV, enabling low‑voltage core operation as defined in the device specifications.
• Temperature & Grade  Industrial grade with an operating temperature range of −40 °C to 100 °C for deployment in harsh environments.
• Standards Compliance  RoHS compliant for materials and manufacturing process alignment with environmental requirements.
• Series Transceiver Support (Series-Level)  Stratix V GX devices are documented with configurable high‑speed transceiver capability and multiple speed grades as described in the Stratix V device documentation.

Typical Applications

• High‑speed communications  Programmable logic combined with Stratix V GX series transceiver capabilities supports implementation of protocol bridges, packet processing, and multi‑lane links.
• Signal processing and acceleration  Large logic capacity and substantial on‑chip RAM enable implementation of compute‑intensive datapaths, filters, and accelerators.
• Industrial control and automation  Industrial temperature rating and abundant I/O make this device suitable for robust control systems and factory automation equipment.
• System integration and prototyping  High I/O count and dense package support board‑level integration and rapid system prototyping where programmable logic density is required.

Unique Advantages

• High programmable capacity: 340,000 logic elements provide the headroom for complex designs and extensive custom logic integration.
• Significant on‑chip memory: Approximately 19.456 Mbits of embedded RAM reduces external memory dependence for buffering and real‑time data handling.
• Large I/O complement: 432 I/O pins support broad peripheral interfacing and parallel bus implementations without many external serializers.
• Industrial robustness: Rated for −40 °C to 100 °C operation to meet demanding environmental requirements in industrial deployments.
• Compact, high‑density packaging: 1152‑BBGA (35×35) FCBGA enables high‑density PCB layouts while maintaining surface‑mount assembly compatibility.
• RoHS compliant: Materials and manufacturing compliance for environmentally conscious designs.

Why Choose 5SGXEA3H3F35I3N?

The 5SGXEA3H3F35I3N combines a high logic element count, large embedded memory, and a dense I/O complement in an industrial‑grade Stratix V GX device. Its package and electrical characteristics make it suitable for designs that require significant programmable resources, robust thermal performance, and compact board integration.

This part is well suited to engineering teams building complex communication, signal processing, or industrial control systems that need scalable programmable logic, extensive on‑chip memory, and reliable operation across extended temperature ranges. The device’s alignment with documented Stratix V GX series capabilities supports integration into designs that leverage family‑level transceiver and performance options.

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