5SGXEA3K1F35C1N

The 5SGXEA3K1F35C1N is an Intel Stratix V GX field-programmable gate array (FPGA) in a 1152-BBGA FCBGA package. It delivers a large fabric capacity and on-chip memory suitable for complex digital designs in commercial applications.

With 340,000 logic elements, approximately 19.456 Mbits of embedded memory and 432 I/Os, this device targets high-density digital signal processing, system integration, and communication-oriented designs that require substantial programmable logic and I/O connectivity.

Key Features

• Logic Capacity  340,000 logic elements provide extensive programmable fabric for large designs and complex algorithms.
• On-chip Memory  Approximately 19.456 Mbits of embedded memory to support buffering, FIFOs, and local storage for datapaths and control logic.
• I/O Resources  432 user I/Os to support mixed I/O interfaces, board-level integration, and high pin-count system designs.
• Package and Mounting  Supplied in a 1152-BBGA (FCBGA) package; supplier device package listed as 1152-FBGA (35×35). Designed for surface-mount assembly.
• Power Supply  Core voltage supply range from 870 mV to 930 mV for the device core domain.
• Commercial Temperature Grade  Rated for operation from 0 °C to 85 °C, suitable for commercial-environment deployments.
• Standards and Compliance  RoHS compliant.

Typical Applications

• High‑performance signal processing  Use the large logic fabric and embedded memory to implement DSP pipelines, filters, and custom accelerators.
• Telecommunications and data handling  High I/O count and substantial logic resources support packet processing, protocol offload, and interface bridging.
• Compute and control systems  Implement complex control logic, soft processors, and custom state machines within a single FPGA fabric.

Unique Advantages

• Substantial programmable capacity  340,000 logic elements enable consolidation of multiple functions into one device, reducing board-level complexity.
• Significant embedded memory  Approximately 19.456 Mbits of on-chip RAM reduces external memory needs for many buffering and caching tasks.
• High I/O density  432 I/Os allow flexible partitioning of interfaces and direct connection to a wide range of peripherals and buses.
• Commercial deployment ready  Commercial temperature rating (0 °C to 85 °C) aligns with standard commercial electronics environments and product lifecycles.
• RoHS compliant  Meets common environmental requirements for electronic assemblies.
• Compact BGA footprint  1152-ball FCBGA package (35×35) provides a high-density implementation suitable for compact system boards.

Why Choose 5SGXEA3K1F35C1N?

The 5SGXEA3K1F35C1N balances high logic density, on-chip memory, and generous I/O resources in a commercial-grade Stratix V GX device. It is appropriate for engineers building complex digital systems that require consolidation of functions, substantial local memory, and flexible interfacing options. The device’s 1152-BBGA surface-mount package and RoHS compliance make it practical for modern assembly flows and commercial product designs.

For designs that need scalable programmable fabric with ample embedded RAM and I/O, this Stratix V GX part offers a capable platform supported by Intel’s Stratix V family documentation and electrical characterizations.

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