5SGXEA3K1F35C2L

The 5SGXEA3K1F35C2L is a Stratix® V GX Field Programmable Gate Array (FPGA) from Intel. It combines high logic capacity, substantial on-chip memory, and a high I/O count in a 1152-ball FCBGA package to address complex programmable logic requirements.

With 340,000 logic elements and approximately 19.456 Mbits of embedded memory, this commercial-grade device is suited for designs that require dense logic, generous on-chip storage, and extensive interfacing capability while operating within a standard commercial temperature range.

Key Features

• Logic Capacity 340,000 logic elements for implementing large-scale programmable logic designs.
• Embedded Memory Approximately 19.456 Mbits of on-chip RAM to support data buffering, frame storage, and intermediate processing without external memory for many use cases.
• I/O Integration 432 general-purpose I/Os to enable extensive device interfacing and board-level connectivity.
• Package and Mounting 1152-BBGA (FCBGA) package, supplier device package 1152-FBGA (35×35), designed for surface-mount assembly.
• Power Supply Core voltage supply specified between 820 mV and 880 mV to match system power-rail planning.
• Commercial Temperature Grade Rated for operation from 0 °C to 85 °C and designated as a commercial-grade device.
• RoHS Compliance Device is RoHS compliant for regulatory and manufacturing considerations.

Typical Applications

• High-density programmable logic — Suited for implementations that require a large number of logic elements and substantial on-chip RAM.
• High I/O interface designs — Ideal where many parallel or multiplexed I/O channels are required, leveraging the 432 I/Os.
• Embedded processing and buffering — On-chip memory capacity supports buffering and intermediate data storage in complex data paths.

Unique Advantages

• Substantial logic resources: 340,000 logic elements provide headroom for complex state machines, datapaths, and custom logic integration.
• Significant on-chip RAM: Approximately 19.456 Mbits of embedded memory reduces reliance on external memory for many designs, simplifying board-level architecture.
• High I/O count: 432 I/Os enable broad interfacing options for connectivity-intensive applications.
• Compact BGA footprint: 1152-ball FCBGA (35×35) package offers a high-pin-count solution in a single surface-mount package for dense board layouts.
• Commercial-grade operating range: Designed for 0 °C to 85 °C operation to meet standard commercial deployment environments.
• Regulatory readiness: RoHS compliance supports modern manufacturing and environmental requirements.

Why Choose 5SGXEA3K1F35C2L?

The 5SGXEA3K1F35C2L positions itself as a high-capacity Stratix V GX FPGA option for engineers needing a combination of large logic resources, ample embedded memory, and a high number of I/Os in a single surface-mount BGA package. Its commercial-grade rating and defined core supply range make it suitable for mainstream electronic systems that require predictable electrical and thermal characteristics.

For designs that demand scalable logic density, significant on-chip storage, and broad interfacing capability while maintaining a compact package profile, this Intel Stratix V GX device provides a balanced platform backed by the Stratix V device family specifications.

If you would like pricing, availability, or to request a quote for part 5SGXEA3K1F35C2L, please submit a request or inquiry through your preferred procurement channel.