5SGXEA3K1F35C2N

The 5SGXEA3K1F35C2N is a Stratix® V GX Field Programmable Gate Array (FPGA) from Intel, supplied in a 1152-BBGA (35×35) FCBGA package for surface-mount applications. This commercial-grade device provides a high-capacity programmable fabric with a large on-chip memory complement and substantial I/O, making it suitable for demanding, high-density digital designs.

Designed for applications that require significant logic resources, embedded memory, and broad I/O, this Stratix V GX device delivers integration and flexibility while operating within a 0 °C to 85 °C commercial temperature range and a core voltage supply of 870 mV to 930 mV.

Key Features

• Core logic — 340,000 logic elements provide extensive programmable resources for complex digital systems and custom acceleration tasks.
• Logic block count — 128,300 logic blocks to organize and scale designs across the programmable fabric.
• Embedded memory — Approximately 19.456 Mbits of on-chip RAM to support large data buffers, state storage, and local memory needs without external RAM.
• I/O and interfacing — 432 I/O pins enable wide external connectivity and high-density board-level interfacing.
• Power — Core supply range of 870 mV to 930 mV, enabling operation tuned to the Stratix V core voltage requirements.
• Package and mounting — 1152-BBGA (FCBGA) package, supplier device package 1152-FBGA (35×35), optimized for surface-mount PCB assembly.
• Temperature and grade — Commercial-grade device rated for operation from 0 °C to 85 °C.
• Compliance — RoHS-compliant construction.

Typical Applications

• High-density custom logic — Use the 340,000 logic elements to implement complex state machines, algorithmic pipelines, and large-scale logic integration directly on-chip.
• Large on-chip buffering and memory — Approximately 19.456 Mbits of embedded RAM supports buffering, packet staging, and local data storage to reduce external memory dependency.
• High I/O, multi-channel systems — 432 I/O pins accommodate multi-channel interfaces, parallel sensor arrays, and extensive board-level I/O routing.
• Compact, surface-mount designs — The 1152-BBGA package enables a compact PCB footprint while providing high pin density for demanding integration needs.

Unique Advantages

• High logic capacity: 340,000 logic elements enable large-scale designs and significant functional integration on a single device.
• Substantial embedded memory: Approximately 19.456 Mbits of on-chip RAM reduces reliance on external memory and simplifies board-level design.
• Extensive I/O resources: 432 I/O pins support complex interfacing requirements and multi-channel connectivity without multiplexing compromises.
• Compact BGA footprint: 1152-BBGA (35×35) package delivers high pin count in a compact, surface-mount form factor for dense PCB layouts.
• Commercial-grade operating range: Rated for 0 °C to 85 °C operation to meet standard commercial deployment environments.
• RoHS compliant and Intel-backed: Device is RoHS compliant and is part of the Stratix V family from Intel, supported by comprehensive device documentation.

Why Choose 5SGXEA3K1F35C2N?

The 5SGXEA3K1F35C2N combines large-scale programmable logic, significant embedded memory, and broad I/O in a single commercial-grade Stratix V GX FPGA package. Its specification set is suited for designers who need to consolidate complex digital functions and substantial local memory into a compact surface-mount device while maintaining predictable operating voltage and temperature ranges.

This device is ideal for engineers and procurement teams targeting high-density FPGA implementations that require strong on-chip resources and a high pin count. Backed by Intel Stratix V family documentation, the 5SGXEA3K1F35C2N offers a clear specification profile for evaluating performance, power, and integration tradeoffs during system design.

Request a quote or submit an availability inquiry to review pricing and lead times for the 5SGXEA3K1F35C2N.