5SGXEA3K1F40C1N

The 5SGXEA3K1F40C1N is a Stratix® V GX field programmable gate array (FPGA) from Intel. It delivers very high logic capacity and a large embedded memory complement in a 1517-ball FCBGA package designed for surface-mount assembly.

With approximately 340,000 logic elements, roughly 19.456 Mbits of on-chip RAM, and 696 user I/Os, this device targets designs that require high logic density, extensive I/O connectivity, and low-voltage core operation within a commercial temperature range.

Key Features

• Core Logic  Approximately 340,000 logic elements, providing high-density programmable logic for complex digital designs.
• Logic Array Blocks  Listed device logic block count: 128,300, enabling structured resource allocation for large designs.
• Embedded Memory  Approximately 19.456 Mbits of on-chip RAM for buffering, FIFOs, and intermediate storage without external memory.
• I/O Capacity  696 user I/Os to support wide parallel interfaces, high-pin-count subsystems, and extensive peripheral connectivity.
• Power and Core Voltage  Core supply voltage range from 820 mV to 880 mV, supporting low-voltage operation common to advanced FPGA cores.
• Package and Mounting  1517-BBGA FCBGA package (supplier device package: 1517-FBGA, 40×40) optimized for surface-mount assembly.
• Operating Grade  Commercial temperature grade with an operating range of 0 °C to 85 °C.
• Regulatory  RoHS compliant.

Typical Applications

• High-density digital processing  Use the device where large logic capacity and embedded RAM are needed for signal processing, compute pipelines, or algorithm acceleration.
• High-pin-count interface systems  Leverage 696 I/Os for broad peripheral connectivity, parallel buses, and multi-channel interfaces.
• Communications and networking  Employ the Stratix V GX in systems that require substantial on-chip logic and memory resources to implement packet processing, protocol handling, or data aggregation.

Unique Advantages

• High logic density: Approximately 340,000 logic elements support large, complex FPGA designs without immediate need for multiple devices.
• Substantial on-chip memory: Approximately 19.456 Mbits of embedded RAM reduces dependency on external memory for buffering and intermediate storage.
• Extensive I/O count: 696 user I/Os provide flexibility for connecting numerous peripherals, lanes, and parallel interfaces within a single device.
• Compact FCBGA package: The 1517-ball FCBGA (40×40) package delivers a high pin density in a surface-mount form factor suitable for compact boards.
• Low-voltage core operation: Core supply specified between 820 mV and 880 mV to match modern FPGA power domains and system designs.
• Commercial temperature operation: Rated for 0 °C to 85 °C to meet typical commercial electronic applications and deployment environments.

Why Choose 5SGXEA3K1F40C1N?

The 5SGXEA3K1F40C1N brings large-scale programmable logic, significant embedded memory, and very high I/O capacity in a compact 1517-ball FCBGA package. Its specification set makes it appropriate for complex digital designs that require high logic density and broad external connectivity while operating within commercial temperature limits.

As part of the Stratix® V GX family from Intel, this device is supported by documented device characteristics and electrical specifications that help engineers design to known operating and power conditions.

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