5SGXEA3K1F40C2LG

The 5SGXEA3K1F40C2LG is a Stratix® V GX FPGA in a 1517-BBGA (1517-FBGA, 40×40) surface-mount package. It delivers high-density programmable logic with 340,000 logic elements and approximately 19.456 Mbits of embedded RAM for complex digital designs.

Designed for commercial-grade applications, this device provides extensive I/O connectivity (696 I/Os) and operates with a core supply range of 820 mV to 880 mV and an ambient operating range of 0 °C to 85 °C. It targets designs that require large logic capacity, significant on-chip memory, and high I/O counts.

Key Features

• Core Logic 340,000 logic elements provide substantial programmable fabric for logic, state machines, and custom accelerators.
• Embedded Memory Approximately 19.456 Mbits of on-chip RAM to support buffering, LUT-based storage, and embedded data structures.
• I/O and System Integration 696 I/O pins enable dense connectivity for multi-channel systems, parallel interfaces, and board-level consolidation.
• Power Supply Core voltage supply specified at 820 mV to 880 mV, enabling defined power domain planning for system designers.
• Package & Mounting 1517-BBGA (1517-FBGA, 40×40) surface-mount package suitable for compact, high-density board designs.
• Commercial Temperature Grade Rated for operation from 0 °C to 85 °C for commercial-environment deployments.
• Compliance RoHS compliant to support regulatory and assembly requirements.
• Stratix V GX Family Characteristics As a Stratix V GX device, the family is documented with multiple core and transceiver speed-grade offerings in the series datasheet.

Typical Applications

• High-density digital systems — Use the large logic element count and embedded RAM for complex control logic, packet processing, or logic-intensive FPGA functions.
• High I/O count platforms — Leverage 696 I/Os to integrate multiple parallel interfaces, expanded peripheral sets, or board-level signal aggregation.
• Embedded memory buffering — Approximately 19.456 Mbits of on-chip RAM supports buffering, packet queues, and intermediate data storage for streaming or batching tasks.
• System consolidation — Combine multiple functions into a single FPGA package to reduce BOM and simplify board-level routing in commercial products.

Unique Advantages

• High logic capacity: 340,000 logic elements enable large-scale programmable designs without immediate partitioning across multiple devices.
• Significant on-chip RAM: Approximately 19.456 Mbits of embedded memory reduces dependence on external memory for mid-sized buffering and state storage.
• Extensive I/O connectivity: 696 I/Os allow flexible interfacing to many peripherals and high channel counts directly from the FPGA.
• Compact, manufacturable package: 1517-BBGA (1517-FBGA, 40×40) surface-mount package supports dense board layouts and automated assembly.
• Defined power envelope: Core voltage specified between 820 mV and 880 mV simplifies power supply design and domain planning.
• Commercial operating range: Rated for 0 °C to 85 °C, matching typical commercial deployment environments.

Why Choose 5SGXEA3K1F40C2LG?

The 5SGXEA3K1F40C2LG combines a high logic-element count, substantial embedded RAM, and a very large I/O complement in a compact FCBGA package, delivering a platform suitable for complex commercial FPGA designs that demand integration and flexibility. Its documented family characteristics in the Stratix V GX datasheet provide designers with series-level guidance for speed grades and transceiver options.

This device is well suited to engineering teams needing to consolidate multiple functions onto a single programmable device while maintaining predictable power and thermal considerations within commercial temperature limits. RoHS compliance and standard surface-mount packaging support modern manufacturing flows.

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