5SGXEA3K1F40C2N

The 5SGXEA3K1F40C2N is a Stratix V GX Field Programmable Gate Array (FPGA) IC providing large programmable logic capacity and extensive I/O connectivity. It targets designs that require high-density logic resources and substantial on-chip memory while remaining within a commercial-temperature specification.

Built on the Stratix V GX device family, this FPGA integrates a high count of logic elements, abundant embedded RAM, and a large I/O complement in a 1517-ball BGA package for surface-mount assembly.

Key Features

• Logic Capacity  Approximately 340,000 logic elements (logic element cells) to implement complex digital functions and custom hardware accelerators.
• Embedded Memory  Approximately 19.46 Mbits of embedded memory (on-chip RAM) for buffering, packet processing, or intermediate storage within logic pipelines.
• I/O Density  696 user I/Os to support high pin-count interface requirements and dense board-level connectivity.
• Package  1517-BBGA (FCBGA) package; supplier device package listed as 1517-FBGA (40×40), optimized for surface-mount PCB assembly.
• Power and Core Voltage  Specified core voltage range of 870 mV to 930 mV to match power-supply and thermal design targets.
• Operating Range & Grade  Commercial grade device with an operating temperature range of 0 °C to 85 °C.
• Standards & Compliance  RoHS compliant, supporting lead-free manufacturing and regulatory requirements for environmental compliance.
• Stratix V GX Family Characteristics  Part of the Stratix V GX family; device electrical and transceiver characteristics are documented in the Stratix V device datasheet.

Typical Applications

• High-density logic implementations  Use the 340,000 logic elements to consolidate large state machines, custom accelerators, and complex control logic into a single FPGA.
• Memory-intensive processing  Approximately 19.46 Mbits of embedded memory supports buffering, packet queues, and intermediate data storage for signal or data processing flows.
• High I/O connectivity systems  With 696 I/Os, the device suits applications requiring many external interfaces or parallel connections to peripherals and daughtercards.

Unique Advantages

• Large programmable fabric  A high count of logic elements enables consolidation of multiple functions into a single device, reducing board-level component count.
• Substantial on-chip RAM  Nearly 19.46 Mbits of embedded memory reduces dependence on external memory for many buffering and temporary-storage needs.
• Extensive I/O headroom  696 I/Os provide flexibility for complex interfacing, allowing designers to support numerous external signals without multiplexing compromises.
• Commercial temperature rating  Rated for 0 °C to 85 °C, matching a wide range of commercial electronic products and controlled-environment systems.
• Manufacturing-friendly package  1517-ball BGA surface-mount package (1517-FBGA, 40×40) supports standard PCB assembly processes and dense board layouts.
• RoHS compliance  Environmentally compliant construction supports lead-free manufacturing and global electronic product regulations.

Why Choose 5SGXEA3K1F40C2N?

The 5SGXEA3K1F40C2N combines high logic density, substantial embedded RAM, and a very large I/O count in a commercial-grade Stratix V GX FPGA package. It is well suited for designs that require consolidating multiple digital functions, on-chip buffering, and broad external interfacing while adhering to commercial operating-temperature and RoHS requirements.

Designers and procurement teams looking for a high-capacity Stratix V GX device will find this part appropriate for complex digital systems that benefit from integrated memory, high I/O density, and a BGA surface-mount package for compact board designs.

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