5SGXEA3K1F40I2N

The 5SGXEA3K1F40I2N is a Stratix V GX Field Programmable Gate Array (FPGA) from Intel, offered in an industrial temperature grade and a 1517-ball FCBGA package. It delivers very high logic density and extensive I/O capability, making it suitable for designs that require large on-chip logic resources, significant embedded memory, and high pin counts.

With 340,000 logic elements, approximately 19.456 Mbits of embedded memory, and 696 I/O pins, this device targets applications that need high integration density and robust thermal and voltage operating ranges.

Key Features

• Core Logic Capacity  Approximately 340,000 logic elements to implement large, complex digital designs and parallel processing functions.
• Embedded Memory  Approximately 19.456 Mbits of on-chip RAM for buffers, FIFOs, and local data storage to support high-throughput designs.
• I/O Density  696 I/O pins to support wide parallel interfaces, multiple high-pin-count peripherals, and complex board-level connectivity.
• Power Supply  Core voltage range specified from 870 mV to 930 mV for precise power domain planning and supply design.
• Package & Mounting  1517-BBGA (FCBGA) package, supplier device package listed as 1517-FBGA (40×40); surface-mount device optimized for compact board integration.
• Temperature Grade  Industrial grade with an operating temperature range of –40 °C to 100 °C for use in demanding environments.
• Standards & Compliance  RoHS compliant to support environmentally conscious designs.

Typical Applications

• High-density digital processing  Implement complex logic, DSP chains, or custom accelerators using the device’s large logic element count and embedded memory.
• High-pin-count system controllers  Manage wide parallel buses, multiple peripherals, and extensive board-level I/O with 696 available I/Os.
• High-bandwidth communications  Leverage the Stratix V GX family’s transceiver-oriented architecture (series-level characteristic) and high I/O density for serial and parallel communications subsystems.
• Industrial systems  Industrial-grade temperature range and surface-mount packaging make the device suitable for robust control and automation equipment operating across a wide temperature span.

Unique Advantages

• High integration density: Large logic element count combined with substantial embedded RAM reduces external component count and simplifies board design.
• Extensive I/O capability: 696 I/Os enable multi-channel interfaces and flexible partitioning between on-chip logic and off-chip peripherals.
• Industrial temperature rating: Rated for –40 °C to 100 °C, supporting deployment in temperature-challenging environments.
• Precise core voltage window: 870 mV to 930 mV supply range supports controlled power budgeting and reliable core operation.
• FCBGA package for compact systems: 1517-ball FCBGA (40×40) packaging allows for high-density board layouts while maintaining thermal and electrical performance.
• RoHS compliant: Meets environmental compliance expectations for modern electronics production.

Why Choose 5SGXEA3K1F40I2N?

The 5SGXEA3K1F40I2N delivers a combination of very high logic capacity, significant embedded memory, and large I/O resources in an industrial-grade Stratix V GX FPGA package. These characteristics make it a strong choice for engineers designing complex digital systems, high-throughput communications interfaces, and industrial controllers that require robust thermal and voltage operating envelopes.

Choosing this device provides a scalable platform with substantial on-chip resources that reduce external component needs, support dense board integration, and align with RoHS environmental requirements.

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