5SGXEA3K2F35C1N

The 5SGXEA3K2F35C1N is a Stratix V GX Field Programmable Gate Array (FPGA) IC from Intel. It provides a high-density programmable logic fabric with 340,000 logic elements and approximately 19.46 Mbits of embedded memory, enabling complex digital designs that require substantial on-chip resources.

Designed for surface-mount assembly in a 1152-ball FCBGA package (1152-FBGA, 35×35), this commercial-grade device supports up to 432 I/Os and operates from a core supply range of 870 mV to 930 mV with an ambient operating range of 0 °C to 85 °C. The Stratix V device datasheet covers the device's electrical and switching characteristics, including operating conditions, power consumption, switching/transceiver specifications, and I/O timing.

Key Features

• Core Logic Capacity  340,000 logic elements provide a large programmable fabric for complex logic, custom datapaths, and system integration.
• Embedded Memory  Approximately 19.46 Mbits of on-chip RAM to support buffers, FIFOs, and state storage without external memory.
• I/O Count  432 user I/Os to connect a broad range of peripherals and high-pin-count interfaces directly to the FPGA.
• Package & Mounting  Supplied in a 1152-BBGA (FCBGA) package, supplier device package 1152-FBGA (35×35); intended for surface-mount PCB assembly.
• Power and Voltage  Core supply operating range from 870 mV to 930 mV, enabling precise core power delivery within specified limits.
• Operating Range & Grade  Commercial temperature grade with an operating ambient range of 0 °C to 85 °C.
• Standards Compliance  RoHS compliant for regulatory and environmental considerations.
• Documented Electrical & Switching Characteristics  The Stratix V device datasheet provides detailed electrical, switching, transceiver, and I/O timing information for design validation.

Typical Applications

• Programmable logic systems  Deploy as on-board programmable logic where reconfigurable hardware is required.
• High-capacity digital designs  Use in designs that need significant logic density and embedded RAM.
• High I/O-count interfaces  Suitable for systems that require abundant user I/Os for external connectivity.

Unique Advantages

• High integration density: 340,000 logic elements consolidate complex functions into a single device, reducing board-level component count.
• Substantial on-chip memory: Approximately 19.46 Mbits of embedded RAM minimize dependence on external memory for buffering and storage.
• Generous I/O resources: 432 I/Os support multiple peripherals and parallel interfaces without extensive external multiplexing.
• Compact BGA package: 1152-ball FCBGA (35×35) offers a space-efficient package for high-pin-count applications.
• Commercial temperature grade: Rated for 0 °C to 85 °C operation to meet standard commercial deployment environments.
• Regulatory compliance: RoHS compliance supports environmentally conscious designs and supply-chain requirements.

Why Choose 5SGXEA3K2F35C1N?

The 5SGXEA3K2F35C1N combines high logic density, significant embedded memory, and a large I/O complement in a compact 1152-ball FCBGA package, making it suited to designs that require substantial on-chip resources and flexible connectivity. Its documented electrical and switching characteristics in the Stratix V device datasheet support rigorous design validation for complex digital systems.

As a commercial-grade Stratix V GX device from Intel, it provides a verified platform for teams needing a high-capacity, reprogrammable silicon foundation while meeting common environmental and regulatory expectations such as RoHS compliance.

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