5SGXEA3K2F35C2LG

The 5SGXEA3K2F35C2LG is an Intel Stratix® V GX field-programmable gate array (FPGA) device in a 1152-BBGA (FCBGA) package. It provides a high-density programmable logic fabric with substantial on-chip memory and a large I/O count for complex digital designs.

This commercial-grade FPGA (0 °C to 85 °C) is suitable for designs requiring extensive logic capacity, embedded memory, and high pin count integration while operating at a low core voltage of 820 mV to 880 mV.

Key Features

• Logic Capacity — 340,000 logic elements to implement large-scale programmable logic and complex algorithms.
• Embedded Memory — Approximately 19.456 Mbits of on-chip RAM (Total RAM Bits: 19,456,000) for buffering, state storage, and memory-intensive functions.
• I/O Resources — 432 general-purpose I/Os to connect to peripherals, interfaces, and board-level signals.
• Package & Mounting — 1152-BBGA (FCBGA) supplier package 1152-FBGA (35×35) designed for surface-mount assembly.
• Power — Core supply voltage range: 820 mV to 880 mV, enabling low-voltage core operation.
• Temperature & Grade — Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Standards Compliance — RoHS compliant.

Typical Applications

• High-density programmable logic — Use where extensive on-chip logic and memory are required, leveraging 340,000 logic elements and ~19.456 Mbits of embedded RAM.
• High I/O-count systems — Designs that require a large number of external signals or interfaces can make use of the 432 I/Os.
• Commercial electronic products — Devices and systems designed for operation within a 0 °C to 85 °C commercial temperature range.

Unique Advantages

• Highly integrated logic and memory: Combines 340,000 logic elements with approximately 19.456 Mbits of on-chip RAM to reduce external memory needs and simplify board design.
• Large I/O capacity: 432 I/Os provide flexibility for multi-interface designs and high pin-count connectivity.
• Compact high-pin-count package: 1152-BBGA (35×35) packaging enables a dense footprint while supporting extensive I/O and routing.
• Low-voltage core operation: Core supply range of 820 mV–880 mV supports modern low-voltage system architectures.
• Commercial temperature suitability: Rated for 0 °C to 85 °C, appropriate for a broad range of commercial applications.
• RoHS compliant: Meets RoHS requirements for lead-free manufacturing and environmental compliance.

Why Choose 5SGXEA3K2F35C2LG?

The 5SGXEA3K2F35C2LG delivers a combination of very large logic capacity, substantial on-chip memory, and high I/O density in a compact 1152-BBGA surface-mount package. As a member of the Stratix V GX family, it is targeted at commercial designs that need extensive programmable resources while operating at a low core voltage.

Choose this device for designs where integration of logic, memory, and I/O can reduce board-level complexity and accelerate development. Its commercial operating range and RoHS compliance make it suitable for production systems intended for commercial deployments.

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