5SGXEA3K2F35C3N
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 432 19456000 340000 1152-BBGA, FCBGA |
|---|---|
| Quantity | 945 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FBGA (35x35) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 432 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 128300 | Number of Logic Elements/Cells | 340000 | ||
| Number of Gates | N/A | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 19456000 |
Overview of 5SGXEA3K2F35C3N – Stratix® V GX Field Programmable Gate Array (FPGA) IC, 340000 logic elements, 1152-BBGA
The Intel Stratix V GX device 5SGXEA3K2F35C3N is a high-density Field Programmable Gate Array (FPGA) supplied in a 1152-ball BGA package (35 mm × 35 mm). It provides 340,000 logic elements and approximately 19.456 Mbits of embedded memory for complex digital designs.
Designed for commercial-grade applications, this Stratix V GX FPGA features 432 I/O pins, core voltage operation in the 820 mV–880 mV range, surface-mount assembly, and an operating temperature range of 0 °C to 85 °C. The device is RoHS-compliant.
Key Features
- Core Logic 340,000 logic elements enable implementation of large-scale, custom digital functions and compute fabrics.
- Embedded Memory Approximately 19.456 Mbits of on-chip RAM supports buffering, lookup tables, and memory-intensive logic.
- I/O Density 432 available I/O pins provide extensive connectivity for parallel interfaces and board-level integration.
- Power and Voltage Core supply specified between 820 mV and 880 mV for low-voltage FPGA core operation.
- Package 1152-BBGA (also specified as 1152-FBGA, 35×35) surface-mount package suitable for high-density PCB layouts.
- Temperature & Grade Commercial grade with an operating temperature range of 0 °C to 85 °C.
- Standards Compliance RoHS-compliant construction for environmental compliance in commercial products.
- Documentation Stratix V device family electrical and switching characteristics, including I/O timing and transceiver specifications, are covered in the device datasheet.
Unique Advantages
- High logic density: 340,000 logic elements provide the capacity needed to integrate large digital subsystems on a single device.
- Substantial on-chip memory: Approximately 19.456 Mbits of embedded RAM reduces external memory dependencies and streamlines board design.
- Robust I/O capability: 432 I/O pins support complex interfacing requirements and flexible I/O partitioning.
- Compact, manufacturable package: 1152-ball BGA (35×35) surface-mount package enables high-density PCB routing while supporting standard assembly processes.
- Commercial temperature suitability: Rated for 0 °C to 85 °C operation to match a wide range of commercial electronic products.
- Environmental compliance: RoHS status ensures conformity with common environmental requirements.
Why Choose 5SGXEA3K2F35C3N?
The 5SGXEA3K2F35C3N Stratix V GX FPGA combines large programmable logic capacity, significant embedded memory, and extensive I/O in a single commercial-grade package. Its defined core voltage range and documented electrical and switching characteristics make it suitable for designs that require predictable power and timing behavior.
This device is well suited to teams and projects that need to consolidate complex digital functions into a single FPGA, reduce board-level memory requirements, and leverage a high pin-count BGA for dense board layouts. The Stratix V family documentation provides further detail on device electrical characteristics and transceiver capabilities to assist system-level integration and verification.
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