5SGXEA3K2F35C3N

IC FPGA 432 I/O 1152FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 432 19456000 340000 1152-BBGA, FCBGA

Quantity 945 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1152-BBGA, FCBGANumber of I/O432Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs128300Number of Logic Elements/Cells340000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits19456000

Overview of 5SGXEA3K2F35C3N – Stratix® V GX Field Programmable Gate Array (FPGA) IC, 340000 logic elements, 1152-BBGA

The Intel Stratix V GX device 5SGXEA3K2F35C3N is a high-density Field Programmable Gate Array (FPGA) supplied in a 1152-ball BGA package (35 mm × 35 mm). It provides 340,000 logic elements and approximately 19.456 Mbits of embedded memory for complex digital designs.

Designed for commercial-grade applications, this Stratix V GX FPGA features 432 I/O pins, core voltage operation in the 820 mV–880 mV range, surface-mount assembly, and an operating temperature range of 0 °C to 85 °C. The device is RoHS-compliant.

Key Features

  • Core Logic  340,000 logic elements enable implementation of large-scale, custom digital functions and compute fabrics.
  • Embedded Memory  Approximately 19.456 Mbits of on-chip RAM supports buffering, lookup tables, and memory-intensive logic.
  • I/O Density  432 available I/O pins provide extensive connectivity for parallel interfaces and board-level integration.
  • Power and Voltage  Core supply specified between 820 mV and 880 mV for low-voltage FPGA core operation.
  • Package  1152-BBGA (also specified as 1152-FBGA, 35×35) surface-mount package suitable for high-density PCB layouts.
  • Temperature & Grade  Commercial grade with an operating temperature range of 0 °C to 85 °C.
  • Standards Compliance  RoHS-compliant construction for environmental compliance in commercial products.
  • Documentation  Stratix V device family electrical and switching characteristics, including I/O timing and transceiver specifications, are covered in the device datasheet.

Unique Advantages

  • High logic density: 340,000 logic elements provide the capacity needed to integrate large digital subsystems on a single device.
  • Substantial on-chip memory: Approximately 19.456 Mbits of embedded RAM reduces external memory dependencies and streamlines board design.
  • Robust I/O capability: 432 I/O pins support complex interfacing requirements and flexible I/O partitioning.
  • Compact, manufacturable package: 1152-ball BGA (35×35) surface-mount package enables high-density PCB routing while supporting standard assembly processes.
  • Commercial temperature suitability: Rated for 0 °C to 85 °C operation to match a wide range of commercial electronic products.
  • Environmental compliance: RoHS status ensures conformity with common environmental requirements.

Why Choose 5SGXEA3K2F35C3N?

The 5SGXEA3K2F35C3N Stratix V GX FPGA combines large programmable logic capacity, significant embedded memory, and extensive I/O in a single commercial-grade package. Its defined core voltage range and documented electrical and switching characteristics make it suitable for designs that require predictable power and timing behavior.

This device is well suited to teams and projects that need to consolidate complex digital functions into a single FPGA, reduce board-level memory requirements, and leverage a high pin-count BGA for dense board layouts. The Stratix V family documentation provides further detail on device electrical characteristics and transceiver capabilities to assist system-level integration and verification.

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