5SGXEA3K2F35I2L

The 5SGXEA3K2F35I2L is an Intel Stratix® V GX field-programmable gate array (FPGA) offered in an industrial temperature grade. It delivers a high-density programmable fabric with substantial on-chip memory and a large I/O count for demanding digital designs.

Designed for applications that require large logic capacity and flexible I/O, this device combines 340,000 logic elements, approximately 19.46 Mbits of embedded memory, and 432 I/Os in a 1152-ball BGA package to support complex system designs and integration needs.

Key Features

• Core Logic Capacity  340,000 logic elements provide a large programmable fabric for complex logic implementation and parallel processing.
• Embedded Memory  Approximately 19.46 Mbits of on-chip RAM to support buffering, lookup tables, and data-path storage without external memory for many functions.
• I/O Density  432 available I/Os to interface with high-pin-count systems and diverse peripheral requirements.
• Package and Mounting  1152-BBGA, FCBGA (supplier package: 1152-FBGA, 35×35) in a surface-mount form factor for compact board-level integration.
• Voltage Supply  Core voltage supply range of 820 mV to 880 mV for the device core.
• Industrial Temperature Grade  Rated for operation from –40°C to 100°C, suitable for industrial environments.
• RoHS Compliance  Device is RoHS compliant for environmental and manufacturing considerations.

Typical Applications

• High-density digital processing  Implement complex finite state machines, wide datapaths, and large combinational logic using the device’s extensive logic resources.
• Signal and packet processing  On-chip memory and abundant logic enable buffering and real-time processing tasks in networking and communications subsystems.
• System integration and prototyping  High I/O count and dense logic make the device suitable for consolidating multiple functions onto a single FPGA during prototyping or product integration.

Unique Advantages

• Significant programmable capacity: 340,000 logic elements reduce the need for multiple devices in large designs, simplifying board layout and BOM.
• Substantial on-chip memory: Approximately 19.46 Mbits of embedded RAM supports data buffering and local storage, lowering external memory dependencies.
• High I/O integration: 432 I/Os enable broad connectivity to peripherals, sensors, and buses without extensive external I/O expanders.
• Industrial-grade thermal range: –40°C to 100°C operation supports deployment in industrial environments where extended temperature tolerance is required.
• Compact BGA package: 1152-ball FCBGA footprint allows dense PCB implementations while maintaining high pin-count connectivity.

Why Choose 5SGXEA3K2F35I2L?

The 5SGXEA3K2F35I2L positions itself as a high-density Stratix V GX FPGA option for designs that demand extensive logic resources, ample embedded memory, and substantial I/O in an industrial-grade package. Its combination of 340,000 logic elements, approximately 19.46 Mbits of on-chip RAM, and 432 I/Os supports consolidation of complex subsystems onto a single programmable device.

Engineers and procurement teams seeking a robust, scalable FPGA platform will find this device suitable for applications that require integration density, industrial temperature tolerance, and a compact surface-mount BGA package.

Request a quote or submit a procurement inquiry to receive pricing and availability for the 5SGXEA3K2F35I2L.