5SGXEA3K2F35I2G

The 5SGXEA3K2F35I2G is a Stratix V GX FPGA offering a large programmable fabric with 340,000 logic elements and approximately 19.456 Mbits of embedded memory. It is supplied in a 1152-BBGA (FCBGA) surface-mount package and is graded for industrial use with an operating range of −40 °C to 100 °C.

With 432 user I/Os and a low-voltage core supply range of 870 mV to 930 mV, this device targets designs that require significant on-chip logic density, abundant I/O, and substantial embedded RAM capacity. As a Stratix V GX series device, it also aligns with the series-level transceiver capabilities described in the device family documentation.

Key Features

• Logic Capacity  340,000 logic elements for high-density programmable logic implementations.
• Embedded Memory  Approximately 19.456 Mbits of on-chip RAM to support buffering, FIFOs, and memory-intensive algorithms.
• I/O and Packaging  432 general-purpose I/Os in a surface-mount 1152-BBGA (FCBGA) package; supplier device package noted as 1152-FBGA (35×35).
• Industrial Temperature Grade  Rated for −40 °C to 100 °C operation, suitable for industrial temperature environments.
• Low-Voltage Core  Core supply range of 870 mV to 930 mV to match low-voltage system designs.
• Series-Level Transceiver Capability  As a Stratix V GX device, the family documentation lists GX transceiver speed grades (series-level), with channel rates up to 14.1 Gbps depending on speed grade.
• Standards Compliance  RoHS compliant, meeting common environmental and manufacturing requirements.

Typical Applications

• High-density programmable logic  Implement complex custom logic functions and large-scale state machines using the device’s 340,000 logic elements and plentiful embedded RAM.
• Memory-intensive processing  On-chip memory (approximately 19.456 Mbits) supports buffering, lookup tables, and packet handling without immediate external memory dependency.
• I/O-rich system integration  With 432 I/Os, use the device for designs that require extensive peripheral interfacing, parallel buses, or multi-domain signal routing.
• Industrial applications  Industrial temperature rating (−40 °C to 100 °C) allows deployment in temperature-challenging environments.

Unique Advantages

• Large programmable fabric: 340,000 logic elements let you implement extensive custom logic and complex processing pipelines on-chip.
• Significant on-chip RAM: Approximately 19.456 Mbits of embedded memory reduces dependence on external memory for many buffering and storage tasks.
• High I/O count: 432 user I/Os provide flexibility for interfacing multiple peripherals and buses without additional I/O expanders.
• Industrial temperature rating: −40 °C to 100 °C operation supports robust deployment in industrial environments.
• Low-voltage core operation: 870 mV–930 mV supply range accommodates low-voltage system designs and power-optimized architectures.
• RoHS compliance: Meets common environmental manufacturing requirements for lead-free assembly.

Why Choose 5SGXEA3K2F35I2G?

The 5SGXEA3K2F35I2G combines substantial logic capacity, meaningful on-chip memory, and a high I/O count in a single industrial-temperature FPGA package. Its low-voltage core operation and series-level support for GX transceivers provide designers with a flexible platform for complex, I/O-heavy, and memory-demanding applications.

This device is well suited to engineers and system architects who need a densely programmable solution with robust thermal range and clear hardware specifications to build scalable, long-lived systems.

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