5SGXEA3K2F35C2N

The 5SGXEA3K2F35C2N is a Stratix V GX Field Programmable Gate Array (FPGA) IC offered in a 1152-BBGA FCBGA package. It delivers high on-chip logic density and embedded memory capacity for complex digital processing, signal conditioning, and I/O‑intensive designs in commercial applications.

Designed for surface-mount integration, this device combines approximately 340,000 logic elements, about 19.456 Mbits of embedded RAM, and 432 I/O pins to support large-scale programmable systems while operating within a commercial temperature range.

Key Features

• Logic Capacity  Approximately 340,000 logic elements to implement large combinational and sequential logic blocks.
• Embedded Memory  Approximately 19.456 Mbits of on-chip RAM for buffers, FIFOs, and application memory structures.
• I/O Density  432 I/O pins suitable for high‑pin-count interfaces and parallel bus implementations.
• Package  1152-BBGA FCBGA (supplier device package: 1152-FBGA, 35×35) optimized for board-level integration and high pin-count routing.
• Power and Voltage  Specified core supply voltage range of 870 mV to 930 mV for core power budgeting and regulator selection.
• Thermal/Grade  Commercial grade operation with an ambient range of 0 °C to 85 °C for a wide set of commercial environments.
• Mounting  Surface-mount device for standard PCB assembly flows.
• Compliance  RoHS compliant.

Typical Applications

• High-performance digital processing  Large-scale logic capacity and extensive on-chip RAM make this device suitable for complex data-paths, algorithm acceleration, and custom DSP implementations.
• High-density I/O systems  With 432 I/Os, the device supports multi-channel interfaces, parallel data acquisition, and dense board-level connectivity.
• Protocol bridging and interface aggregation  Use the logic and memory resources to implement protocol translation, packet buffering, and aggregation functions in communication equipment.

Unique Advantages

• High logic integration: The large logic element count enables consolidation of multiple system functions into a single FPGA, reducing board-level component count.
• Substantial on‑chip memory: Approximately 19.456 Mbits of embedded RAM supports deep buffering and complex state storage without external memory.
• High I/O count: 432 I/Os provide flexibility for interfacing with multiple peripherals, sensors, and external devices simultaneously.
• Commercial temperature rating: Rated 0 °C to 85 °C for compatibility with a wide range of commercial systems and environments.
• Compact high-pin-count package: 1152-BBGA FCBGA (35×35) provides dense I/O routing while maintaining a compact PCB footprint.
• Regulated core voltage range: Defined 870–930 mV supply simplifies power-supply design and core power budgeting.

Why Choose 5SGXEA3K2F35C2N?

The 5SGXEA3K2F35C2N positions itself for designers who need a high‑capacity, I/O‑dense FPGA in a commercial-grade device. Its combination of approximately 340,000 logic elements, roughly 19.456 Mbits of embedded RAM, and 432 I/Os supports demanding digital designs that require on-chip memory and substantial interface count while fitting into a 1152‑ball BGA package.

This Stratix V GX device is suitable for development teams and system integrators seeking a scalable, high‑integration solution backed by Stratix V family documentation and engineering resources. Its power and thermal specifications aid predictable system-level power budgeting and thermal planning.

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