5SGXEA3K2F35C2G

The 5SGXEA3K2F35C2G is a Stratix® V GX Field Programmable Gate Array (FPGA) IC from Intel. It delivers a high-density, programmable logic fabric packaged in a 1152-ball FCBGA suitable for surface-mount assembly.

Specifically characterized as a commercial-grade device, this FPGA provides 340,000 logic elements, approximately 19.456 Mbits of on-chip RAM, and up to 432 I/O pins, with a core voltage supply range of 870 mV to 930 mV and an operating temperature range of 0 °C to 85 °C.

Key Features

• Core Logic  340,000 logic elements provide a high-capacity programmable fabric for complex digital designs.
• Embedded Memory  Approximately 19.456 Mbits of on-chip RAM enable substantial on-device storage for buffering, lookup tables, and state machines.
• I/O Density  Up to 432 I/O pins support broad connectivity options for parallel interfaces and multi-channel systems.
• Power and Supply  Core voltage supply specified from 870 mV to 930 mV for defined operating conditions.
• Package  1152-ball FCBGA (1152-FBGA, 35×35 mm) surface-mount package provides a compact, high-pin-count footprint.
• Thermal Grade  Commercial operating temperature range of 0 °C to 85 °C for standard environment deployments.
• Regulatory  RoHS compliant.

Typical Applications

• High-density programmable logic designs  Use the 340,000 logic elements to implement large-scale state machines, datapaths, and custom accelerators.
• On-chip buffering and memory-heavy functions  Approximately 19.456 Mbits of embedded RAM supports frame buffers, FIFOs, and lookup tables without immediate external memory dependence.
• I/O-intensive systems  Up to 432 I/O pins accommodate multi-channel interfaces, parallel buses, and mixed-signal front-ends.
• Commercial electronic systems  Commercial temperature grade and surface-mount FCBGA package make this device suitable for standard commercial-product assemblies.

Unique Advantages

• High logic capacity: 340,000 logic elements permit implementation of complex algorithms and large custom logic blocks on a single device.
• Substantial embedded memory: Approximately 19.456 Mbits of on-chip RAM reduces reliance on external memory for many buffering and storage needs.
• Extensive I/O: 432 I/O pins enable dense interfacing options, simplifying board-level routing for multi-channel designs.
• Compact high-pin-count package: The 1152-FBGA (35×35) package balances I/O availability with a compact footprint for board-level integration.
• Commercial-grade operating range: Rated for 0 °C to 85 °C, appropriate for standard commercial deployments.
• Regulatory compliance: RoHS compliance supports environmentally conscious manufacturing requirements.

Why Choose 5SGXEA3K2F35C2G?

The 5SGXEA3K2F35C2G combines a large programmable fabric, significant embedded memory, and high I/O density in a single commercial-grade Stratix V GX FPGA package. These specifications make it suitable for designs that require substantial on-chip resources and flexible interfacing while maintaining a compact board footprint.

Engineers specifying this device benefit from clearly defined electrical and thermal parameters — including core voltage range and operating temperature — and a RoHS-compliant, surface-mount FCBGA package that fits common commercial production flows.

Request a quote or submit a sales inquiry to evaluate 5SGXEA3K2F35C2G for your next design and to obtain pricing and availability information.