5SGXEA3K2F35C2LN

The 5SGXEA3K2F35C2LN is an Intel Stratix V GX field programmable gate array supplied in a 1152-BBGA (35 × 35 mm) FCBGA package. It provides a large programmable fabric with a high logic capacity and substantial on-chip RAM suited for complex digital designs.

With 340,000 logic elements, approximately 19.456 Mbits of embedded memory and 432 general-purpose I/Os, this commercial-grade device is designed for designs that require high logic density, extensive I/O count, and significant embedded memory capacity while operating from a core supply range of 820 mV to 880 mV.

Key Features

• Core Logic  Approximately 340,000 logic elements provide a large programmable fabric for complex combinational and sequential logic implementations.
• Embedded Memory  Approximately 19.456 Mbits of on-chip RAM to support large data buffering, state storage, and memory-intensive algorithms.
• Programmable Logic Blocks  128,300 logic array blocks (reported device logic resources) to structure and partition design functions efficiently.
• I/O Resources  432 I/O pins for broad interfacing capability to external devices, peripherals, and mezzanine modules.
• Power  Core voltage supply specified from 820 mV to 880 mV to match target power and performance operating points.
• Package & Mounting  1152-BBGA (FCBGA) package; supplier device package listed as 1152-FBGA (35 × 35 mm). Surface-mount mounting type for board-level integration.
• Temperature & Grade  Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Regulatory  RoHS-compliant construction.

Typical Applications

• FPGA-based Prototyping  Use the large logic capacity and abundant I/O to prototype complex SoC and ASIC functions on a single device.
• High-density Logic Integration  Integrate extensive combinational and sequential logic in a single device, leveraging 340,000 logic elements for dense implementations.
• I/O-Intensive Systems  Systems that require many external interfaces can take advantage of the device’s 432 I/Os for sensor, peripheral, and bus connectivity.
• Embedded Memory-Heavy Designs  Designs that need significant on-chip buffering or local storage can leverage approximately 19.456 Mbits of embedded RAM.

Unique Advantages

• Large Programmable Fabric:  Approximately 340,000 logic elements enable consolidation of large designs onto a single FPGA, reducing board-level complexity.
• Substantial On-Chip RAM:  Approximately 19.456 Mbits of embedded memory supports data-intensive algorithms and large buffering without external memory dependence.
• High I/O Count:  432 I/Os provide flexible connectivity options for multi-channel interfaces and complex peripheral routing.
• Compact, Surface-Mount Package:  1152-BBGA (35 × 35 mm) FCBGA packaging balances high pin-count requirements with board-level density and surface-mount assembly.
• Commercial Temperature Range:  Rated for 0 °C to 85 °C operation to align with commercial product requirements and environments.
• Regulatory Compliance:  RoHS-compliant to support environmentally conscious manufacturing and procurement.

Why Choose 5SGXEA3K2F35C2LN?

The 5SGXEA3K2F35C2LN delivers a combination of high logic capacity, significant embedded memory, and a large I/O count in a single Stratix V GX FPGA package. Its specifications make it well-suited for complex, high-density digital designs that require substantial on-chip resources and flexible interfacing, while remaining within commercial operating temperatures and a defined core voltage range.

Engineers and procurement teams seeking a high-capacity, RoHS-compliant FPGA with a compact 1152-BBGA package and explicit electrical limits can evaluate this device for designs that prioritize integration density, significant local memory, and extensive I/O availability.

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