5SGXEA3K2F35C2L

The 5SGXEA3K2F35C2L is a Stratix V GX family Field Programmable Gate Array (FPGA) IC from Intel, packaged in a 1152-ball FCBGA. It delivers a large programmable fabric with extensive on-chip memory and a high I/O count for demanding digital designs.

Designed for commercial-grade systems, this device supports a broad range of applications that require dense logic, significant embedded memory, and multi-gigabit serial capability as described for the Stratix V GX series.

Key Features

• Logic Capacity — 340,000 logic elements (cells) to implement complex, high-density logic and custom hardware acceleration.
• Embedded Memory — Approximately 19.5 Mbits of on-chip RAM for buffers, FIFOs, and lookup tables.
• I/O Resources — 432 general-purpose I/O pins to support wide parallel buses, multiple interfaces, and board-level connectivity.
• Transceiver Capability (Series-Level) — Stratix V GX family transceivers support high serial data rates (series-level specifications include channels up to 14.1 Gbps), enabling high-speed serial links when applicable to the device.
• Power and Voltage — Core voltage supply specified between 820 mV and 880 mV for the device core.
• Package and Mounting — 1152-BBGA / FCBGA package (supplier device package: 1152-FBGA, 35 × 35 mm) in a surface-mount form factor.
• Commercial Temperature Grade — Rated for 0 °C to 85 °C operation.
• RoHS Compliant — Meets RoHS requirements for lead-free assemblies.

Typical Applications

• High-density FPGA designs — Implement large-scale custom logic, hardware acceleration, and complex state machines using the device’s 340,000 logic elements and embedded RAM.
• I/O-intensive systems — Support wide parallel interfaces, sensor arrays, or board-level buses with 432 available I/Os.
• High-speed serial communications — Leverage the Stratix V GX family transceiver capabilities for multi-gigabit SERDES links in communication and network equipment (series-level transceiver specifications apply).
• Commercial embedded systems — Deploy in products operating in standard commercial environments, using the device’s 0 °C to 85 °C rating and surface-mount 1152-FBGA package.

Unique Advantages

• Large programmable fabric: 340,000 logic elements enable complex algorithms and deep pipelining without external ASICs.
• Substantial on-chip memory: Approximately 19.5 Mbits of embedded RAM reduces reliance on external memory for buffering and state storage.
• High I/O density: 432 I/Os simplify board-level routing for parallel interfaces and multi-channel systems.
• Commercial-grade robustness: Specified 0 °C to 85 °C operating range aligns with a wide range of standard commercial applications.
• Industry-standard package: 1152-ball FCBGA (35 × 35 mm) offers a compact surface-mount solution for high-pin-count FPGA deployments.
• RoHS compliance: Facilitates lead-free manufacturing and regulatory conformity.

Why Choose 5SGXEA3K2F35C2L?

The 5SGXEA3K2F35C2L positions itself as a high-capacity, commercial-grade FPGA option within the Stratix V GX family, combining a large number of logic elements, significant embedded memory, and a high I/O count in a compact 1152-ball FCBGA package. This configuration is suited to engineers and system designers who require dense programmable logic, on-chip memory resources, and substantial connectivity for complex digital and communication designs.

Choosing this device provides scalability for advanced designs while leveraging Intel’s Stratix V GX series characteristics for high-speed serial applications at the series level. Its commercial temperature rating and RoHS compliance support reliable integration into standard commercial products.

Request a quote or submit an RFQ to evaluate 5SGXEA3K2F35C2L for your next design and get details on availability and pricing.