5SGXEA3K1F40I2G

The 5SGXEA3K1F40I2G is a Stratix® V GX family FPGA in a 1517-BBGA (FCBGA) package, engineered for high-density, high-performance programmable logic applications. It integrates 340,000 logic elements and approximately 19.5 Mbits of embedded memory, plus 696 user I/Os, making it suitable for designs that require extensive on-chip logic, memory, and I/O connectivity.

Offered in an industrial temperature grade with a specified operating range of −40 °C to 100 °C and a core supply range of 870 mV to 930 mV, this device targets demanding environments where reliability and long-term availability are important.

Key Features

• Core Logic  340,000 logic elements for complex digital designs and large-scale integration.
• Embedded Memory  Approximately 19.5 Mbits of on-chip RAM to support buffering, FIFOs, and embedded data structures.
• I/O Density  696 user I/Os to accommodate high-pin-count interfaces and multi-channel connectivity.
• Transceiver Options (device family)  Stratix V GX family devices include transceiver speed grades described in the device datasheet, with options up to 14.1 Gbps for transceiver-enabled configurations.
• Power and Supply  Core voltage supply specified between 870 mV and 930 mV to align with system power budgets and core performance settings.
• Package & Mounting  1517-BBGA (FCBGA) package; supplier package reference 1517-FBGA (40×40). Surface-mount mounting type for standard board assembly processes.
• Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C for use in temperature-critical installations.
• RoHS Compliant  Conforms to RoHS requirements for reduced hazardous substances.

Typical Applications

• High-speed serial and transceiver-based designs  Leverage the Stratix V GX family transceiver options to implement multi‑Gbps serial links and protocol bridging.
• High-density logic integration  Use the 340,000 logic elements to consolidate complex RTL, custom accelerators, and protocol engines on a single device.
• Memory-intensive embedded processing  Approximately 19.5 Mbits of embedded RAM supports packet buffering, deep FIFOs, and on-chip data handling.
• Industrial and rugged systems  Industrial-grade rating and −40 °C to 100 °C operating range suit applications that require wide temperature operation.

Unique Advantages

• High logic capacity: 340,000 logic elements enable integration of large, multi-function designs to reduce external components and board complexity.
• Substantial on-chip memory: Approximately 19.5 Mbits of embedded RAM provides local storage for buffering and real-time data processing tasks.
• Extensive I/O footprint: 696 user I/Os allow flexible interfacing to multiple peripherals, parallel buses, and daughtercard connections.
• Industrial robustness: Rated industrial temperature range and RoHS compliance support deployment in temperature-challenging environments and compliant manufacturing.
• Package density: 1517-BBGA (FCBGA) 40×40 form factor enables a high pin-count, compact board layout for space-constrained systems.
• Scalable transceiver capability: Family-level transceiver speed grades documented in the datasheet enable selection of appropriate high-speed serial performance for system needs.

Why Choose 5SGXEA3K1F40I2G?

The 5SGXEA3K1F40I2G delivers a balance of large logic capacity, significant embedded memory, and extensive I/O in a surface-mount 1517-BBGA package. Its industrial temperature rating and defined core supply range make it appropriate for designs that require dependable operation across harsh temperature ranges while maintaining complex, high‑density logic and memory requirements.

Engineers designing transceiver-enabled, memory- and logic-intensive systems will find this Stratix V GX device well suited for consolidating functions, reducing BOM count, and supporting long-term deployment where industrial-grade operation and RoHS compliance are required.

Request a quote or submit a procurement inquiry to receive availability and pricing for the 5SGXEA3K1F40I2G. Our team can provide technical details, lead-time information, and support for integration into your design cycle.