5SGXEA3K1F40C2WN

The 5SGXEA3K1F40C2WN is a Stratix® V GX field programmable gate array (FPGA) from Intel, delivered in a 1517-BBGA FCBGA package for surface-mount applications. This commercial-grade device provides a high count of programmable logic, abundant I/O, and substantial on-chip memory for complex, high-density designs.

With 340,000 logic elements and approximately 19.5 Mbits of embedded memory, the device targets applications that require large programmable logic capacity, extensive I/O connectivity (696 I/O), and a compact FCBGA footprint. The device operates over a core supply window of 870 mV to 930 mV and an ambient temperature range of 0 °C to 85 °C.

Key Features

• Core FPGA Architecture  Stratix V GX family FPGA device optimized for high-density programmable logic as indicated by device naming and datasheet family information.
• Logic Capacity  340,000 logic elements to support complex digital designs and large combinational/sequential logic implementations.
• Embedded Memory  Approximately 19.5 Mbits of on-chip RAM for buffering, state storage, and local data handling.
• I/O Resources  696 user I/O pins to support wide parallel interfaces, extensive board-level connectivity, and multiple peripheral domains.
• Power Supply  Core voltage supply range: 870 mV to 930 mV, enabling defined power provisioning for the device core.
• Package & Mounting  1517-BBGA (FCBGA) package; supplier device package listed as 1517-FBGA (40×40). Surface-mount device for PCB assembly.
• Temperature & Grade  Commercial grade device with an operating ambient temperature range of 0 °C to 85 °C.
• Environmental Compliance  RoHS compliant.

Typical Applications

• High-density data processing  Large logic capacity and significant on-chip RAM make this device suitable for compute-intensive data-paths and packet processing.
• Communications and networking  Extensive I/O count supports multi-lane interfaces and broad board-level connectivity for networking equipment and line cards.
• Hardware acceleration  Substantial logic and memory resources enable implementation of application-specific accelerators and custom datapaths.
• Prototyping and platform development  The combination of high logic density and many I/Os supports system-level prototyping and complex evaluation designs.

Unique Advantages

• High logic capacity: 340,000 logic elements provide the headroom for large-scale, multi-function designs.
• Large on-chip memory: Approximately 19.5 Mbits of embedded RAM reduces external memory dependency for many buffering and stateful functions.
• Extensive I/O footprint: 696 I/O pins enable wide parallel interfaces and multiple peripheral connections without additional I/O expanders.
• Compact FCBGA package: 1517-BBGA package in a 1517-FBGA (40×40) supplier footprint supports dense PCB layouts while maintaining high pin count.
• Commercial temperature rating: Specified for 0 °C to 85 °C operation to match commercial product deployment environments.
• Environmental compliance: RoHS status ensures conformity with common lead-free manufacturing requirements.

Why Choose 5SGXEA3K1F40C2WN?

The 5SGXEA3K1F40C2WN delivers a balance of high logic density, sizable embedded memory, and very large I/O capability in a surface-mount FCBGA package. As a commercial-grade Stratix V GX device from Intel, it is positioned for designers who need substantial programmable resources and broad connectivity in their board-level or platform designs.

This part is suitable for engineering teams developing complex digital systems, communications equipment, or hardware-accelerated processing platforms that require on-chip capacity and diverse interfacing options while operating within a defined commercial temperature and supply range.

Request a quote or submit a procurement inquiry for 5SGXEA3K1F40C2WN to initiate availability and pricing details.