5SGXEA3K1F40C2L

The 5SGXEA3K1F40C2L is a Stratix V GX Field Programmable Gate Array (FPGA) IC from Intel, offered in a 1517-ball FCBGA package. This commercial-grade FPGA provides a high-density programmable logic fabric and substantial embedded memory to support complex digital designs and system integration.

Designed for applications that require large logic capacity, extensive I/O, and on-chip RAM, the device delivers a combination of integration and measurable electrical parameters to help engineers optimize performance and power within defined operating conditions.

Key Features

• Logic Capacity  340,000 logic elements suited for large-scale digital designs and complex logic implementations.
• Logic Array Blocks  128,300 LABs reported for scalable logic partitioning and resource planning.
• Embedded Memory  Approximately 19.456 Mbits of on-chip RAM to support buffering, state storage, and on-chip data structures.
• I/O Count  696 I/Os to accommodate wide parallel interfaces and high pin-count system connections.
• Power Supply  Core supply range specified at 820 mV to 880 mV for integration into regulated power domains.
• Package & Mounting  1517-BBGA (FCBGA) package, supplier device package 1517-FBGA (40×40), surface-mount mounting type for standard PCB assembly.
• Temperature & Grade  Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Regulatory Compliance  RoHS compliant.

Typical Applications

• High-density digital processing  Use the large logic element count and abundant on-chip RAM for complex FPGA-based processing tasks and custom accelerators.
• Wide-parallel I/O systems  The 696 I/Os enable broad external connectivity for high-pin-count interfaces and parallel data paths.
• Prototyping and system integration  Suitable for prototyping advanced digital designs and consolidating multiple functions into a single programmable device.

Unique Advantages

• High logic density: 340,000 logic elements let you implement large state machines, datapaths, and control logic without immediate partitioning across devices.
• Significant embedded memory: Approximately 19.456 Mbits of on-chip RAM reduces dependence on external memory for many buffering and frame-storage needs.
• Extensive I/O availability: 696 I/Os provide flexibility for diverse interfaces and parallel bus implementations, simplifying board-level routing choices.
• Surface-mount FCBGA packaging: The 1517-ball FCBGA (40×40) format supports compact board layouts while providing high pin density.
• Defined electrical envelope: Core voltage range (820 mV–880 mV) and commercial temperature rating (0 °C–85 °C) enable straightforward power and thermal planning.
• RoHS compliance: Environmentally compliant manufacturing and assembly compatibility for many commercial product lines.

Why Choose 5SGXEA3K1F40C2L?

The 5SGXEA3K1F40C2L positions itself as a high-capacity, commercial-grade Stratix V GX FPGA suitable for designers requiring large programmable logic, substantial embedded memory, and a high I/O count in a compact FCBGA package. Its specified core voltage range and operating temperature make it straightforward to integrate into regulated systems where commercial-grade parts are appropriate.

This device is well suited to customers developing complex digital systems, prototypes that consolidate multiple functions, or designs that require abundant on-chip resources without moving to a higher-cost or different temperature-grade part. The combination of logic density, memory, and I/O enables consolidation of functions and supports scalable design growth within the Stratix V family context.

Request a quote or submit an inquiry to obtain pricing and availability for the 5SGXEA3K1F40C2L and to discuss lead times and purchasing options.