5SGXEA3K1F35I2N

The 5SGXEA3K1F35I2N is an Intel Stratix® V GX field-programmable gate array supplied in a 1152-ball FCBGA package. This industrial-grade FPGA delivers a high logic density, large on-chip RAM capacity, and a broad I/O complement for complex, I/O‑rich designs.

Designed for surface-mount board assembly, the device supports core supply operation from 870 mV to 930 mV and an extended operating temperature range of −40 °C to 100 °C, enabling deployment in demanding industrial environments.

Key Features

• High logic capacity — Approximately 340,000 logic elements for implementing large-scale digital designs and complex custom logic blocks.
• Embedded memory — Approximately 19.456 Mbits of on-chip RAM to support buffering, large-state machines, and memory-intensive functions without external memory dependencies.
• Rich I/O resources — 432 I/O pins to accommodate dense interface requirements and multiple parallel connections.
• Industrial temperature grade — Rated for operation from −40 °C to 100 °C to meet industrial thermal requirements.
• Core voltage range — Core supply specified from 870 mV to 930 mV for predictable power and timing characteristics.
• Package and mounting — 1152-BBGA FCBGA package (1152-FBGA, 35 × 35 mm supplier package) in a surface-mount form factor for high-density PCB designs.
• Standards compliance — RoHS compliant to support environmentally conscious manufacturing.

Typical Applications

• Large-scale digital integration — Use the abundant logic elements and embedded memory to consolidate multiple functions into a single FPGA implementation.
• I/O‑intensive subsystems — The 432 available I/Os support designs requiring numerous parallel interfaces or complex external connectivity.
• Industrial systems — With an industrial temperature rating and surface-mount FCBGA packaging, the device is suitable for ruggedized control and processing modules.

Unique Advantages

• High on-chip capacity: Large logic element count and substantial embedded RAM reduce the need for external devices, simplifying BOM and board complexity.
• Extensive I/O count: 432 I/Os enable flexible interfacing to sensors, peripherals, and custom mezzanine connections without multiple IO expanders.
• Industrial thermal range: Specified operation from −40 °C to 100 °C supports deployment in temperature-challenging environments.
• Predictable core power: Defined core supply window (870 mV–930 mV) helps with power-supply design and timing stability across the device.
• Surface-mount, high-density package: The 1152-ball FCBGA (35 × 35 mm) package enables compact, high-density PCB layouts while supporting advanced thermal and signal routing strategies.
• RoHS compliant: Aligns with lead‑free manufacturing requirements and environmental regulations.

Why Choose 5SGXEA3K1F35I2N?

The 5SGXEA3K1F35I2N from Intel’s Stratix® V GX family combines high logic density, substantial embedded memory, and a large I/O complement in a robust industrial-grade package. It is a strong fit for engineers targeting consolidated, high‑function designs that require predictable core power and extended temperature operation.

For teams building complex, I/O-heavy systems where on-chip resources matter, this FPGA offers a balanced combination of capacity, connectivity, and package options that support scalable, long‑lived deployments.

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