5SGXEA3K1F35C2LG

The 5SGXEA3K1F35C2LG is a Stratix V GX field programmable gate array (FPGA) in a 1152-BBGA (35×35) FCBGA package designed for commercial applications. It delivers a high-density programmable fabric with substantial on-chip memory and a large I/O complement for complex digital designs.

This device is suited to applications that require significant logic capacity, embedded RAM, and plentiful I/O while operating within a commercial temperature range. Electrical and switching characteristics for the Stratix V family are documented in the device datasheet.

Key Features

• Core Logic  340,000 logic elements (cells) provide a high-density programmable fabric for complex logic implementations.
• Embedded Memory  Approximately 19.456 Mbits of on-chip RAM to support buffering, lookup tables, and state storage.
• I/O Capacity  432 user I/O pins to support multi-channel interfaces and high pin-count systems integration.
• Package & Mounting  1152-BBGA, FCBGA (supplier device package: 1152-FBGA 35×35) in a surface-mount form factor for compact board designs.
• Power  Core voltage supply range from 820 mV to 880 mV, enabling integration into low-voltage power architectures.
• Operating Conditions  Commercial temperature grade with an operating range of 0 °C to 85 °C.
• Compliance  RoHS compliant for regulatory alignment in commercial electronic products.

Typical Applications

• High-density digital processing  Implement complex control, signal-processing, or logic-aggregation functions using the 340,000 logic elements and abundant embedded RAM.
• Multi-channel I/O systems  Leverage 432 I/O pins to interface with numerous peripherals, sensors, or parallel data lanes.
• Platform and system prototyping  Use the device’s high logic and memory resources for FPGA-based prototypes and development platforms.
• Embedded memory–intensive designs  Take advantage of approximately 19.456 Mbits of on-chip RAM for buffering, lookup tables, and frame/packet storage.

Unique Advantages

• High-density logic capacity: 340,000 logic elements enable integration of large, consolidated designs that reduce external glue logic.
• Significant on-chip memory: Approximately 19.456 Mbits of embedded RAM reduces dependence on external memory for many use cases.
• Extensive I/O count: 432 I/Os provide flexibility for parallel interfaces, high channel counts, and complex board-level routing.
• Compact, high-pin-count package: The 1152-BBGA (35×35) FCBGA package balances pin density with a surface-mount footprint for space-constrained PCBs.
• Commercial-grade operating range: Rated for 0 °C to 85 °C, suitable for mainstream embedded and industrial-adjacent applications within that range.
• Regulatory alignment: RoHS compliance supports deployment in commercial products where lead-free requirements apply.

Why Choose 5SGXEA3K1F35C2LG?

The 5SGXEA3K1F35C2LG combines a high logic element count, substantial embedded RAM, and a large I/O complement in a compact 1152-BBGA package to serve demanding commercial FPGA designs. Its documented electrical characteristics as part of the Stratix V family support detailed system-level integration and power planning based on the specified core voltage range.

This device is a fit for engineering teams building complex digital systems that require on-chip memory, abundant I/O, and high logic density while operating within commercial temperature limits. Its specifications enable scalable implementations with clear, verifiable electrical and package parameters.

Request a quote or submit a procurement inquiry to evaluate 5SGXEA3K1F35C2LG for your next design opportunity.