5SGXEA3K1F35C1G

The 5SGXEA3K1F35C1G is a Stratix V GX Field Programmable Gate Array (FPGA) from Intel, supplied in a 1152-ball FCBGA package. It provides a high-density programmable logic fabric combined with substantial on-chip memory and a large I/O count for complex digital designs.

Targeted at commercial applications, this device is appropriate for designs that require extensive logic resources, significant embedded memory, and broad I/O integration while operating within standard commercial temperature and core voltage ranges.

Key Features

• High Logic Capacity  340,000 logic elements to implement large-scale digital designs and complex control logic.
• Embedded Memory  Approximately 19.456 Mbits of on-chip RAM for buffering, FIFOs, and memory-intensive functions.
• Extensive I/O  432 I/O pins to support multi-channel interfaces and dense peripheral connectivity.
• Commercial Temperature Grade  Rated for operation from 0 °C to 85 °C suitable for commercial environments.
• Core Voltage  Core supply operating range from 870 mV to 930 mV to match system power delivery designs.
• Package and Mounting  1152-BBGA (FCBGA) package, supplier package 1152-FBGA (35×35), designed for surface-mount PCB assembly.
• Standards Compliance  RoHS compliant to meet environmental and manufacturing requirements.

Typical Applications

• High-density digital processing  Implement complex FPGA-based datapaths and control logic using the device's large logic and memory resources.
• Multi-channel I/O aggregation  Consolidate multiple peripheral interfaces or parallel data streams using 432 available I/O pins.
• Embedded system acceleration  Offload compute-intensive functions into programmable logic leveraging the abundant logic elements and on-chip RAM.

Unique Advantages

• High integration density: 340,000 logic elements enable consolidation of large designs into a single FPGA, reducing board-level complexity.
• Substantial on-chip memory: Approximately 19.456 Mbits of embedded RAM supports buffering, packet processing, and data staging without external memory.
• Large I/O footprint: 432 I/O pins provide the flexibility to interface with many peripherals or parallel data channels directly.
• Commercial-ready operating range: Designed for 0 °C to 85 °C operation to match standard commercial system requirements.
• Compact FCBGA package: 1152-ball FCBGA (35×35) supports high-density system integration and surface-mount assembly.
• Environmentally compliant: RoHS compliance supports regulatory and manufacturing considerations.

Why Choose 5SGXEA3K1F35C1G?

The 5SGXEA3K1F35C1G combines a high number of logic elements, significant embedded RAM, and a large I/O count in a compact FCBGA package—making it suitable for commercial designs that require dense programmable logic and extensive interfacing. Its specified operating voltage and temperature range enable predictable integration into commercial system power and thermal envelopes.

Engineers looking to consolidate complex functionality into a single FPGA, reduce board-level components, and leverage the Stratix V GX family’s documented electrical and switching characteristics will find this device aligned with those objectives.

Request a quote or submit an inquiry to obtain pricing and availability for part number 5SGXEA3K1F35C1G.