5SGXEA3K1F35C2G

The 5SGXEA3K1F35C2G is a Stratix® V GX field-programmable gate array (FPGA) from Intel, designed for high-density, high-integration digital designs. This device combines a large logic element count with substantial on-chip RAM and a wide complement of I/O to support data-plane and control-plane applications.

Targeted at commercial-grade systems, the device offers a balance of performance and integration for applications that require dense logic resources, significant embedded memory, and extensive I/O connectivity, all in a 1152-ball FCBGA package.

Key Features

• Core Logic  Approximately 340,000 logic elements for implementing complex digital logic, state machines, and custom accelerators.
• Embedded Memory  Approximately 19.46 Mbits of on-chip RAM to store buffers, FIFOs, and configuration data close to logic for low-latency processing.
• I/O Density  432 user I/Os to support broad peripheral and high-pin-count system interfaces without external multiplexing.
• High-speed Transceiver Family  Part of the Stratix V GX family; series documentation lists GX transceiver speed grades included in the Stratix V GX offering.
• Power Supply  Core voltage supply range of 870 mV to 930 mV, enabling operation within the specified low-voltage core window.
• Package  1152-ball BGA (FCBGA), supplier package 1152-FBGA (35×35), providing a compact, high-pin-count footprint for dense board layouts.
• Operating Temperature  Commercial-grade temperature range from 0 °C to 85 °C for typical commercial-environment deployments.
• RoHS Compliant  Manufactured to meet RoHS environmental requirements.

Typical Applications

• High-density networking  Implements packet processing, forwarding engines, and interface bridging where large logic capacity and many I/Os are required.
• Telecom systems  Useful for protocol offload, framing, and buffering functions that benefit from abundant embedded RAM and high logic integration.
• Data center accelerators  Custom hardware accelerators and data-path logic that leverage the large logic element count and on-chip memory.
• High-performance signal processing  Processing blocks and pipelined datapaths that need close, fast-access embedded RAM and extensive I/O connectivity.

Unique Advantages

• High integration capacity: The combination of ~340,000 logic elements and ~19.46 Mbits of on-chip RAM reduces external memory and logic partitioning.
• Extensive I/O availability: 432 user I/Os simplify board-level connectivity for multi-interface designs and high-pin-count peripherals.
• Compact, high-pin package: 1152-ball FCBGA package enables dense routing and high signal-count implementations in a single device footprint.
• Commercial temperature support: Rated for 0 °C to 85 °C, suitable for a wide range of commercial deployments.
• Low-voltage core operation: Core supply window of 870–930 mV supports designs optimized for modern low-voltage power rails.
• RoHS compliance: Environmentally compliant manufacturing for global commercial products.

Why Choose 5SGXEA3K1F35C2G?

The 5SGXEA3K1F35C2G offers a combination of large logic capacity, substantial embedded memory, and plentiful I/O in a compact FCBGA package, making it well suited to commercial systems that require dense programmable logic and close memory integration. Its Stratix V GX family heritage provides documented transceiver and device-grade characteristics useful for designs with high-speed serial and parallel interfaces.

Choose this device when your design demands high integration, flexible I/O, and significant on-chip RAM to minimize external components while maintaining a compact board footprint and commercial-grade operating range.

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