5SGXEA3K1F35C2LN

The 5SGXEA3K1F35C2LN is a Stratix V GX Field Programmable Gate Array (FPGA) from Intel (Altera). It delivers a high-capacity programmable fabric combined with substantial embedded memory and a large I/O count for complex, high-density digital designs.

As a member of the Stratix V GX family, this device targets designs that require significant on-chip logic and memory resources, broad I/O connectivity, and the package and power characteristics needed for commercial-grade systems.

Key Features

• Core Logic Capacity  Approximately 340,000 logic elements provide extensive resources for complex combinational and sequential logic implementations.
• Embedded Memory  Approximately 19.456 Mbits of on-chip RAM to support large buffering, LUT-based storage, and memory-intensive functions.
• I/O Resources  Up to 432 user I/O pins enable wide external connectivity for parallel interfaces, control signals, and peripheral buses.
• Package and Mounting  Supplied in a 1152-BBGA (1152-FBGA, 35 × 35 mm) FCBGA package, designed for surface-mount assembly.
• Power Supply  Core supply operates in the range of 820 mV to 880 mV, enabling integration into regulated power domains.
• Commercial Temperature Grade  Rated for operation from 0 °C to 85 °C, suitable for commercial-grade environments.
• Series-Level Transceiver Options  Part of the Stratix V GX family; the datasheet documents transceiver speed-grade options for the series.
• RoHS Compliant  Meets RoHS requirements for lead-free manufacturing and environmental compliance.

Typical Applications

• High-density programmable logic  Use the large logic element count to implement complex state machines, datapaths, and custom accelerators.
• Memory‑intensive processing  Leverage approximately 19.456 Mbits of embedded RAM for buffering, packet queues, and on-chip data storage.
• Broad I/O interfacing  With up to 432 I/Os, support multi-channel sensor interfaces, parallel buses, or mixed-signal front ends requiring many signals.

Unique Advantages

• Large programmable fabric: Enables complex logic consolidation on a single device, reducing board-level component count.
• Substantial on-chip memory: Approximately 19.456 Mbits of RAM minimizes external memory dependence and shortens data paths.
• High I/O density: 432 I/Os provide flexibility for system integration and support for multiple simultaneous interfaces.
• Commercial-grade availability: Specified for 0 °C to 85 °C operation to match commercial system deployment requirements.
• Industry-grade packaging: 1152-FBGA (35 × 35 mm) package simplifies PCB layout for dense designs and surface-mount assembly.
• Standards-conscious compliance: RoHS compliance supports environmentally conscious manufacturing and procurement.

Why Choose 5SGXEA3K1F35C2LN?

The 5SGXEA3K1F35C2LN combines a high count of logic elements, sizeable embedded memory, and extensive I/O to provide a capable platform for demanding commercial FPGA designs. Its Stratix V GX family heritage means series-level transceiver and switching characteristics are documented for designers who need advanced connectivity options.

This device is well suited for teams building large, integrated digital systems that require on-chip resources to reduce external components, shorten data paths, and consolidate functionality while operating within commercial temperature and supply parameters.

Request a quote or submit a pricing and availability inquiry to receive lead-time and procurement information for the 5SGXEA3K1F35C2LN.