5SGXEA3H3F35I4N

The 5SGXEA3H3F35I4N is an industrial-grade Stratix V GX FPGA designed for high-density, high-performance digital designs. It combines a large logic fabric with substantial embedded memory and a high I/O count to support complex custom hardware implementations.

As a Stratix V GX device, the datasheet documents transceiver-capable device variants and speed-grade options; this part delivers a balance of programmable logic, multi-gigabit transceiver capability (per Stratix V GX device family documentation), and industrial temperature operation for reliable use in demanding environments.

Key Features

• High Logic Capacity — 340,000 logic elements suitable for large-scale programmable logic and system-on-chip style designs.
• Embedded Memory — Approximately 19.456 Mbits of on-chip RAM to support buffering, FIFOs, and data-intensive algorithms.
• Rich I/O — 432 user I/O pins to interface with high-pin-count systems and multiple peripheral domains.
• Transceiver Family — Part of the Stratix V GX family; the series datasheet documents GX transceiver speed-grade support for multi-gigabit channel implementations.
• Power and Core Voltage — Core supply range specified at 820 mV to 880 mV to meet the device’s internal power requirements.
• Package and Mounting — 1152-ball BGA (FCBGA) package, supplier package listed as 1152-FBGA (35 × 35), with surface-mount mounting for standard PCB assembly.
• Industrial Temperature Grade — Rated for operation from –40 °C to 100 °C for deployment in industrial environments.
• Regulatory Compliance — RoHS compliant.

Typical Applications

• High-speed serial communications — Use the Stratix V GX transceiver-capable family characteristics to implement multi-gigabit links and channel aggregation.
• Complex signal processing — Leverage 340,000 logic elements and approximately 19.456 Mbits of embedded memory to implement DSP algorithms, packet processing, and protocol offload functions.
• High-density I/O control — 432 I/O pins enable integration with multiple parallel interfaces, sensors, and board-level subsystems.

Unique Advantages

• Scalable programmable fabric — Large logic capacity allows consolidation of multi-chip functions into a single FPGA, reducing system complexity.
• On‑chip memory for data-intensive tasks — Nearly 19.456 Mbits of embedded RAM supports buffering, deep FIFOs, and in-line data processing without external memory dependency.
• Designed for industrial environments — Rated for –40 °C to 100 °C operation to maintain functionality across a wide temperature range.
• High I/O integration — 432 external I/Os simplify board-level routing and minimize the need for external interface chips.
• Standard BGA packaging — 1152-ball FCBGA (35 × 35) supports automated surface-mount assembly and dense PCB layouts.
• RoHS compliant — Meets lead-free and hazardous substance requirements for modern electronics manufacturing.

Why Choose 5SGXEA3H3F35I4N?

The 5SGXEA3H3F35I4N positions itself as a high-capacity, industrial-temperature Stratix V GX FPGA that integrates abundant logic resources, significant on-chip memory, and a high I/O count in a single 1152-ball BGA package. It is suited to engineers who need programmable performance and reliable operation across temperature extremes while leveraging the Stratix V family’s transceiver-capable architecture documented in the series datasheet.

For designs that require consolidating complex digital functions—such as multi-gigabit serial links, intensive packet or signal processing, and dense peripheral interfacing—this device delivers a verifiable set of capabilities and manufacturing-friendly packaging to support production deployment.

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