5SGXEA3H3F35I3LG

The 5SGXEA3H3F35I3LG is an Intel Stratix® V GX field programmable gate array (FPGA) device configured in a 1152‑ball BGA (FCBGA) package. It provides a high-density programmable logic fabric with extensive embedded memory and a large I/O count for complex digital designs.

Targeted at industrial-temperature applications, this device combines 340,000 logic elements, approximately 19.46 Mbits of on-chip RAM, and up to 432 I/O pins to support demanding compute and I/O aggregation use cases while operating from a core supply range of 0.82–0.88 V.

Key Features

• Logic Capacity 340,000 logic elements to implement large-scale digital systems and complex custom processing engines.
• Embedded Memory Approximately 19.46 Mbits of on-chip RAM for buffering, LUT-based storage and memory-intensive functions.
• I/O Density 432 programmable I/O pins to support wide external interfacing, bridging, and peripheral connectivity.
• Package & Mounting 1152‑BBGA (FCBGA) package, supplier package 1152‑FBGA (35×35), designed for surface-mount PCB assembly.
• Power / Core Supply Specified core supply range of 0.82–0.88 V to match system power-rail design requirements.
• Temperature Grade Industrial temperature rating with specified operating range from −40 °C to 100 °C for deployment in temperature-challenging environments.
• Compliance RoHS‑compliant material status.

Typical Applications

• High‑density digital processing — Implement custom data-paths, parallel accelerators, and complex control logic using the device’s large logic and memory resources.
• I/O‑intensive systems — Aggregate and manage many external interfaces or peripherals with the device’s 432 I/O pins and flexible packaging.
• Industrial automation and controls — Deploy in industrial-temperature environments that require robust programmable logic and substantial on-chip memory.
• Prototyping and system integration — Use the high logic capacity and dense package to validate and integrate large FPGA-based subsystems.

Unique Advantages

• High logic density: 340,000 logic elements provide headroom for complex implementations and algorithmic acceleration on a single device.
• Significant embedded memory: Approximately 19.46 Mbits of on-chip RAM reduces dependence on external memory for many buffering and storage needs.
• Large I/O capability: 432 I/Os support broad peripheral connectivity and multi-channel interfacing without additional multiplexing hardware.
• Industrial temperature rating: The −40 °C to 100 °C operating range supports deployment in temperature-challenging applications.
• Compact, high‑ball‑count package: 1152‑BBGA (35×35) package enables high I/O and logic density in a surface‑mount form factor suitable for compact designs.
• Controlled core supply range: Defined 0.82–0.88 V core supply simplifies power-rail planning for integrated systems.

Why Choose 5SGXEA3H3F35I3LG?

This Intel Stratix® V GX device delivers a balance of large programmable logic capacity, substantial on-chip memory, and extensive I/O in a compact 1152‑BBGA package. Its industrial temperature rating and defined core supply range make it a practical choice for engineers building high‑complexity digital systems that require reliable operation across a wide temperature span.

Design teams seeking to consolidate functions, reduce external memory dependencies, and support many external interfaces will find the 5SGXEA3H3F35I3LG well suited to demanding industrial applications and high‑density FPGA implementations.

Request a quote or submit an inquiry for pricing and availability of the 5SGXEA3H3F35I3LG to evaluate it for your next design.