5SGXEA3H3F35I3L

The 5SGXEA3H3F35I3L is a Stratix® V GX field programmable gate array (FPGA) device offered in an industrial temperature grade. It delivers 340,000 logic elements, approximately 19.456 Mbits of embedded memory, and 432 user I/Os in a 1152-FBGA (35×35) package.

Designed for applications that require large programmable logic capacity and high I/O density, this device operates over a core voltage range of 820 mV to 880 mV and an operating temperature range of −40°C to 100°C, and is RoHS compliant.

Key Features

• Logic Capacity  340,000 logic elements to implement complex custom logic, datapaths, and control functions.
• Embedded Memory  Approximately 19.456 Mbits of on-chip RAM for buffering, FIFOs, and local data storage.
• I/O and Packaging  432 user I/Os in a 1152-BBGA / FCBGA package; supplier device package listed as 1152-FBGA (35×35). Surface-mount package supports compact board-level integration.
• Industrial Temperature Grade  Specified operating range −40°C to 100°C for temperature-sensitive industrial deployments.
• Core Voltage Range  Core supply specified between 820 mV and 880 mV.
• Compliance  RoHS compliant.

Typical Applications

• Industrial Control Systems  Leverages industrial temperature rating and high I/O count for factory automation, motor control interfaces, and rugged control electronics.
• High-Density Logic Implementations  Use the 340,000 logic elements and large embedded memory for complex digital signal processing, protocol offload, or custom hardware acceleration.
• System Integration and Prototyping  Compact 1152-FBGA (35×35) package with extensive I/O enables dense board-level designs and development platforms.

Unique Advantages

• Substantial Logic Resource:  340,000 logic elements provide headroom for large, multi-function designs without external CPLD/FPGA partitioning.
• Significant On‑Chip Memory:  Approximately 19.456 Mbits of embedded RAM reduces dependence on external memory for many buffering and data-path tasks.
• High I/O Density:  432 I/Os in a single 1152-FBGA package supports rich peripheral connectivity and multi-channel interfaces.
• Industrial Operation:  Rated −40°C to 100°C to meet temperature requirements for industrial applications.
• Compact Surface-Mount Packaging:  1152-FBGA (35×35) helps keep board footprint compact while delivering high pin count.
• Regulatory Compliance:  RoHS compliant for global environmental requirements.

Why Choose 5SGXEA3H3F35I3L?

The 5SGXEA3H3F35I3L combines a large logic fabric, substantial embedded memory, and a high I/O count in a single industrial-grade Stratix V GX device. Its core voltage and temperature specifications make it appropriate for designs that require robust, high-capacity programmable logic in constrained board space.

This device is suitable for engineers and designers building complex digital systems that need integrated memory, many I/Os, and an industrial operating range, while maintaining a compact footprint with the 1152-FBGA package.

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