5SGXEA3H3F35I3LN

IC FPGA 432 I/O 1152FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 432 19456000 340000 1152-BBGA, FCBGA

Quantity 662 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1152-BBGA, FCBGANumber of I/O432Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs128300Number of Logic Elements/Cells340000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits19456000

Overview of 5SGXEA3H3F35I3LN – Stratix® V GX Field Programmable Gate Array (FPGA)

The 5SGXEA3H3F35I3LN is a Stratix® V GX family FPGA in a 1152-BBGA/FCBGA package optimized for high-density logic and I/O integration. This industrial-grade device provides a large programmable fabric with extensive on-chip memory and a high I/O count for demanding embedded, networking, and data processing applications.

Designed for systems that require significant logic capacity and deterministic operating conditions, the device combines 340,000 logic elements with approximately 19.456 Mbits of embedded memory and 432 user I/Os, while supporting an industrial operating temperature range and tightly controlled core voltage.

Key Features

  • Core & Logic  340,000 logic elements provide a high-density programmable fabric for complex FPGA implementations.
  • Embedded Memory  Approximately 19.456 Mbits of on-chip RAM to support buffering, lookup tables, and large working data sets.
  • I/O Capacity  432 user I/Os for flexible interfacing with high-pin-count subsystems and board-level connectivity.
  • Power and Supply  Core voltage supply specified between 820 mV and 880 mV to match system power-rail requirements and ensure predictable core behavior.
  • Package & Mounting  1152-BBGA (FCBGA) package; supplier device package listed as 1152-FBGA (35x35). Surface-mount mounting type for standard PCB assembly processes.
  • Temperature & Grade  Industrial grade device rated for an operating temperature range of −40°C to 100°C for use in thermally demanding environments.
  • Regulatory  RoHS compliant to support environmentally responsible designs and manufacturing.
  • Series Documentation  Stratix V device documentation covers electrical and switching characteristics including operating conditions, power consumption, I/O timing, and transceiver/periphery performance.

Typical Applications

  • High‑performance Data Processing  Use the large logic capacity and embedded memory for FPGA-based acceleration, packet processing, and custom compute pipelines.
  • Network & Telecom Infrastructure  High I/O count and series-level transceiver/periphery documentation support implementation of line cards, switches, and network adapters.
  • Industrial Control & Automation  Industrial temperature grading and robust I/O make the device suitable for control systems, motor drives, and factory automation equipment.
  • Test & Measurement  Dense logic and significant on-chip RAM facilitate real-time signal acquisition, processing, and protocol analysis functions.

Unique Advantages

  • High logic density: 340,000 logic elements enable consolidation of multiple functions into a single device, reducing BOM and board area.
  • Substantial on-chip memory: Approximately 19.456 Mbits of embedded RAM supports large buffers and state storage without external memory dependency.
  • Extensive I/O capability: 432 I/Os provide flexibility for dense front-end interfaces and wide parallel buses.
  • Industrial robustness: Rated for −40°C to 100°C operation, suitable for deployments in harsh or thermally variable environments.
  • Predictable core power: Narrow core supply range (820–880 mV) simplifies power design and voltage regulation for consistent performance.
  • RoHS compliant: Supports environmentally conscious product design and manufacturing requirements.

Why Choose 5SGXEA3H3F35I3LN?

The 5SGXEA3H3F35I3LN positions itself as a high-density Stratix V GX FPGA option for designs that require substantial programmable logic, generous embedded memory, and a high I/O count in an industrial-grade package. Its combination of 340,000 logic elements, approximately 19.456 Mbits of on-chip RAM, and 432 I/Os enables consolidation of complex subsystems and reduces reliance on external components.

Engineers targeting networking, data processing, industrial automation, or measurement systems will find the device suited to scalable, robust designs where controlled core voltage, surface-mount 1152-BBGA packaging, and RoHS compliance are important selection criteria. Series documentation provides detailed electrical and switching characteristics to support development and system validation.

Request a quote or submit a pricing inquiry to receive availability and ordering information for the 5SGXEA3H3F35I3LN.

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