5SGXEA3K2F35I2LN

The 5SGXEA3K2F35I2LN is an Intel Stratix V GX field programmable gate array (FPGA) supplied in a 1152-ball FCBGA package. It provides a large programmable fabric with 340,000 logic elements and approximately 19.456 Mbits of embedded memory for complex digital processing and system integration.

Designed for industrial-grade systems, this device supports up to 432 user I/O and operates across a core supply range of 820 mV to 880 mV and an ambient temperature range of -40 °C to 100 °C, making it suitable for demanding embedded and communications applications.

Key Features

• Programmable Logic Capacity  340,000 logic elements provide extensive resources for implementing large-scale digital functions, custom accelerators, and system-level controllers.
• Embedded Memory  Approximately 19.456 Mbits of on-chip RAM to support buffering, look-up tables, and data-path storage without external memory dependencies.
• I/O Density  432 user I/O pins enable high-pin-count interfaces and dense board-level integration for multi-channel data and control signals.
• Industrial Temperature Grade  Qualified for operation from -40 °C to 100 °C, supporting deployment in industrial and harsh-environment applications.
• Power and Core Supply  Core voltage supply range of 820 mV to 880 mV to match system power requirements and enable predictable power budgeting.
• Package and Mounting  1152-BBGA (FBGA, 35 × 35 mm) surface-mount package delivers a compact, high-pin-count form factor for board-level integration.
• Manufacturer  Produced by Intel (Altera Stratix V family), with datasheet and family-level electrical characteristics available for design reference.

Typical Applications

• High-performance Communications  Implement protocol processing, data-path acceleration, and multi-channel I/O aggregation using the large logic fabric and abundant I/O.
• Industrial Control Systems  Deploy real-time control, signal conditioning, and custom logic in temperature-sensitive environments thanks to the industrial temperature rating.
• Data Acquisition and Processing  Use embedded memory and extensive logic to buffer, preprocess, and route high-throughput sensor or instrumentation data.
• Custom Hardware Accelerators  Build application-specific compute blocks and hardware accelerators that require significant on-chip logic and RAM resources.

Unique Advantages

• Large Integrated Fabric: 340,000 logic elements enable consolidation of multiple functions into a single device, reducing board-level BOM and complexity.
• Substantial On-Chip Memory: Approximately 19.456 Mbits of embedded RAM minimizes dependence on external memory for many buffering and storage needs.
• High I/O Count: 432 I/O pins support dense external interfacing for multi-lane data systems and mixed-signal front ends.
• Industrial Reliability: Rated for -40 °C to 100 °C operation, making the device suitable for industrial deployments that require extended temperature tolerance.
• Compact High-Pin Package: The 1152-ball FCBGA (35 × 35 mm) package delivers a balance of pin density and board-level footprint for space-constrained designs.

Why Choose 5SGXEA3K2F35I2LN?

The 5SGXEA3K2F35I2LN positions itself as a high-capacity Stratix V GX FPGA that combines a large logic resource pool, significant embedded memory, and a high I/O count in an industrial-grade package. Its electrical and thermal specifications support integration into robust systems where on-chip resources and temperature resilience are required.

This device is suitable for engineers and system designers targeting complex digital signal processing, communications, and industrial control applications who need predictable supply and temperature ranges, a compact high-pin-count package, and substantial on-chip logic and RAM to reduce external component count and simplify design architectures.

Request a quote or submit a pricing inquiry to begin integrating the 5SGXEA3K2F35I2LN into your next design.