5SGXEA3K2F35I3G

IC FPGA 432 I/O 1152FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 432 19456000 340000 1152-BBGA, FCBGA

Quantity 337 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1152-BBGA, FCBGANumber of I/O432Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs128300Number of Logic Elements/Cells340000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits19456000

Overview of 5SGXEA3K2F35I3G – Stratix® V GX Field Programmable Gate Array (FPGA) IC, 340,000 logic elements

The 5SGXEA3K2F35I3G is a Stratix V GX family field programmable gate array (FPGA) IC providing high-density programmable logic and substantial on-chip memory in a 1152-ball BGA package. It is targeted at high-density programmable logic applications that require large logic capacity, abundant embedded RAM, high I/O counts, and industrial temperature operation.

As a member of the Stratix V GX series, device capabilities include high I/O integration and transceiver support as defined in the Stratix V device documentation. The device combines core logic, embedded memory, and high I/O count to support complex digital designs in industrial environments.

Key Features

  • Core logic — 340,000 logic elements (LEs) to implement large-scale programmable logic and complex RTL designs.
  • Embedded memory — Approximately 19.46 Mbits of on-chip RAM to support large buffering, FIFOs, and memory-intensive functions.
  • I/O capacity — 432 user I/O pins for extensive peripheral connectivity and parallel interfaces.
  • Transceiver capability — Stratix V GX family transceiver support with published GX channel rates up to 14.1 Gbps for applicable speed grades, per Stratix V device documentation.
  • Power and core voltage — Core voltage supply range from 820 mV to 880 mV, supporting defined operating conditions for the device core.
  • Package and mounting — 1152-ball BGA (FCBGA) supplier package: 1152-FBGA (35 × 35 mm); surface-mount device suitable for high-density PCB designs.
  • Industrial temperature grade — Rated for operation from –40 °C to 100 °C and specified as industrial grade.
  • Standards and documentation — Device electrical and switching characteristics are documented in the Stratix V device datasheet, which covers operating conditions, power, and transceiver specifications.

Typical Applications

  • High-speed networking — Use the device's high I/O count and GX transceiver capability to implement packet processing, aggregation, or PHY interfacing in network equipment designs.
  • Data center acceleration — Large logic density and substantial on-chip RAM enable hardware acceleration tasks such as packet inspection, offload functions, and custom compute kernels.
  • Digital signal processing — The combination of abundant logic elements and embedded memory supports DSP pipelines, filtering, and high-throughput data paths.
  • Industrial control and instrumentation — Industrial temperature rating and high I/O count make the device suitable for complex control systems, sensor aggregation, and interface bridging in industrial environments.

Unique Advantages

  • High integration density: 340,000 logic elements enable consolidation of complex systems into a single FPGA, reducing external component count and board area.
  • Large on-chip memory: Approximately 19.46 Mbits of embedded RAM supports deep buffering and on-chip data management without external memory in many use cases.
  • Robust I/O resources: 432 I/O pins provide flexibility for wide parallel buses, multiple high-speed interfaces, and extensive peripheral connectivity.
  • Industrial temperature operation: Rated for –40 °C to 100 °C, allowing deployment in environments that require extended temperature ranges.
  • Documented transceiver performance: Stratix V GX series transceiver specifications (including GX channel rates up to 14.1 Gbps for applicable speed grades) are covered in the device documentation, aiding high-speed serial design planning.
  • Compact, industry-standard packaging: 1152-ball FCBGA (35 × 35 mm) provides a compact solution for high-pin-count FPGA implementations.

Why Choose 5SGXEA3K2F35I3G?

The 5SGXEA3K2F35I3G positions itself as a high-density, industrial-grade Stratix V GX FPGA that combines extensive logic resources, substantial embedded RAM, and a high I/O count in a compact 1152-ball BGA package. These attributes make it suitable for teams designing high-throughput, memory-intensive, or I/O-heavy systems where integration and temperature robustness are important.

Designers benefit from the Stratix V family documentation for electrical, switching, and transceiver characteristics, enabling engineering teams to plan power, timing, and high-speed serial interfaces with reference specifications. The device is well suited to projects that require scalable programmable logic capacity and documented device behavior for industrial deployments.

Request a quote or submit an inquiry to receive pricing, availability, and additional technical information for the 5SGXEA3K2F35I3G.

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