5SGXEA3K2F35I3N

The 5SGXEA3K2F35I3N is an Intel Stratix V GX field programmable gate array (FPGA) offered in an industrial temperature grade and a 1152‑ball BGA package. It delivers high logic density, substantial embedded memory, and a large I/O complement for demanding system designs that require configurable hardware resources and industrial operating range.

With approximately 340,000 logic elements, roughly 19.5 Mbits of embedded memory, and 432 I/O pins, this device is targeted at applications needing high integration, flexible I/O, and robust temperature and power operating windows.

Key Features

• Core Logic  Approximately 340,000 logic elements and 128,300 logic blocks provide extensive programmable logic capacity for complex digital functions.
• Embedded Memory  Approximately 19.5 Mbits of on‑chip RAM to support buffering, FIFOs, and on‑die storage for data‑intensive tasks.
• I/O  432 I/O pins enable rich external connectivity and high pin count interfaces for multi‑lane or multi‑channel designs.
• Package & Mounting  1152‑BBGA (FCBGA), supplier package 1152‑FBGA (35×35), surface mount for high‑density PCB integration.
• Power  Core voltage supply range specified from 820 mV to 880 mV for device core operation.
• Temperature & Grade  Industrial grade device with an operating temperature range of −40 °C to 100 °C for robust field deployment.
• Standards & Compliance  RoHS compliant to meet current environmental requirements.
• Stratix V Family Capabilities  As part of the Stratix V GX family, the device is documented within the Stratix V device datasheet with family-level transceiver and speed‑grade information for system planning.

Typical Applications

• Industrial Control and Automation  Industrial temperature rating and broad I/O make the device suitable for programmable control, motor drive interfaces, and rugged industrial systems.
• High‑density Logic and Acceleration  Large logic element count and on‑chip memory support compute acceleration, custom processing blocks, and complex state machines.
• High‑pin‑count System Integration  432 I/O pins enable integration of multiple parallel interfaces, sensor clusters, or multi‑lane connectivity on a single FPGA.
• Prototyping and System Development  The configurable resources and family documentation support design exploration and hardware prototyping within Stratix V GX device capabilities.

Unique Advantages

• High Logic Density: Approximately 340,000 logic elements reduce the need for multiple devices by consolidating large designs into a single FPGA.
• Substantial On‑chip Memory: Around 19.5 Mbits of embedded RAM enables local buffering and lowers dependency on external memory for many functions.
• Robust Industrial Operating Range: Rated from −40 °C to 100 °C to support deployment in temperature‑challenging environments.
• Large I/O Capacity: 432 I/O pins provide flexibility for complex interconnects and multi‑interface implementations.
• Compact BGA Packaging: 1152‑ball FCBGA package (35×35) supports high integration density and surface‑mount assembly.
• Regulatory Compliance: RoHS compliance supports environmentally regulated product programs.

Why Choose 5SGXEA3K2F35I3N?

The 5SGXEA3K2F35I3N combines large programmable logic capacity, meaningful on‑chip memory, and a high I/O count in an industrial‑grade Stratix V GX FPGA package. This configuration is suitable for engineering teams building high‑integration systems that require configurable hardware, robust thermal performance, and a compact BGA footprint.

Designed for designs that demand scalability and reliable operation, the device aligns with projects needing significant logic and memory resources while maintaining industry‑grade operating conditions and compliance with RoHS requirements.

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