5SGXEA3K2F35I3LG

The 5SGXEA3K2F35I3LG is a Stratix® V GX Field Programmable Gate Array (FPGA) IC from Intel. It is a high‑density FPGA device characterized by a large logic element count and substantial on‑chip RAM, delivered in a 1152‑BBGA (35×35) surface‑mount package.

Designed and specified for industrial use, the device combines 340,000 logic elements with approximately 19.5 Mbits of embedded memory and 432 user I/O pins, making it suited to designs that require high integration, significant local memory, and robust I/O capacity.

Key Features

• Core Density  340,000 logic elements for high‑complexity digital designs.
• Embedded Memory  Approximately 19.5 Mbits of on‑chip RAM to support buffers, FIFOs, and system memory needs.
• I/O Capacity  432 general‑purpose I/O pins to support wide external interfacing and multi‑channel connectivity.
• Package & Mounting  1152‑BBGA (FCBGA) supplier package in a 35×35 format; surface‑mount assembly.
• Power Supply  Core voltage supply specified between 820 mV and 880 mV.
• Temperature & Grade  Industrial grade with an operating temperature range of −40 °C to 100 °C.
• Series-Level Transceiver Options  As a Stratix V GX device, the family is offered with transceiver speed grades (series documentation describes available transceiver speed grades and related characteristics).

Typical Applications

• High‑density digital processing  Use where large logic capacity (340,000 logic elements) and on‑chip RAM enable complex custom logic, signal processing, or algorithm acceleration.
• High‑pin‑count I/O systems  Systems requiring extensive external interfacing benefit from the device’s 432 I/O pins for parallel or multi‑channel connectivity.
• Industrial deployments  Industrial equipment and systems that operate across wide temperatures can make use of the device’s −40 °C to 100 °C rating and industrial grade designation.
• Custom high‑speed serial interfaces (series level)  The Stratix V GX family documentation outlines transceiver speed grade options for designs requiring configurable serial link capabilities.

Unique Advantages

• High logic integration: 340,000 logic elements enable consolidation of complex logic into a single device, reducing board-level component count.
• Substantial embedded memory: Approximately 19.5 Mbits of on‑chip RAM provides local storage for buffering, packet processing, and state machines without relying solely on external memory.
• Extensive I/O availability: 432 I/O pins support broad connectivity requirements, simplifying interfacing to sensors, FPGAs, processors, or peripherals.
• Industrial temperature rating: Specified −40 °C to 100 °C operating range supports deployments in demanding environmental conditions.
• Compact surface‑mount BBGA package: 1152‑BBGA (35×35) format balances high pin count with a compact footprint for dense board layouts.
• Controlled core supply window: Specified 820–880 mV supply range enables predictable power provisioning and margining in system designs.

Why Choose 5SGXEA3K2F35I3LG?

The 5SGXEA3K2F35I3LG delivers a combination of high logic density, significant on‑chip memory, and large I/O capacity in an industrial‑rated Stratix V GX device. Its specifications make it suitable for engineers who need a single FPGA to implement complex logic, high‑capacity buffering, and broad external interfacing while meeting industrial temperature requirements.

Choosing this device provides a compact, surface‑mount BBGA package with controlled core supply requirements and documented series‑level transceiver options, supporting designs that prioritize integration, deterministic power budgeting, and operation across a wide temperature range.

Request a quote or submit a pricing inquiry today to receive part availability and procurement information for the 5SGXEA3K2F35I3LG.