5SGXEA3K2F35I3L

The 5SGXEA3K2F35I3L is an Intel Stratix® V GX field programmable gate array (FPGA) supplied in a 1152‑BBGA FCBGA package. It integrates a large logic fabric, substantial on‑chip RAM, and a high IO count in a surface‑mount FCBGA footprint.

This device is intended for designs that require high logic density, significant embedded memory capacity, and extensive I/O connectivity while operating across an industrial temperature range and a low-voltage core supply.

Key Features

• Logic Capacity  Approximately 340,000 logic elements (cells) to implement large, complex digital functions.
• Embedded Memory  Approximately 19.456 Mbits of on‑chip RAM to support data buffering, FIFOs, and memory‑intensive logic.
• I/O Resources  432 user I/O pins to support wide parallel interfaces and multiple peripheral connections.
• Package  1152‑BBGA (FCBGA) supplier package, 1152‑FBGA (35×35) footprint for surface‑mount PCB assembly.
• Voltage Supply  Core supply range of 820 mV to 880 mV, enabling designs targeting low‑voltage FPGA core operation.
• Operating Temperature  Industrial temperature grade specified from –40°C to 100°C for deployment in demanding thermal environments.
• Mounting & Compliance  Surface‑mount device with RoHS compliance for lead‑free assembly processes.

Typical Applications

• High‑density digital processing  Use the large logic element count and embedded RAM to implement complex pipelines, signal processing blocks, and custom datapaths.
• Communication interfaces  The combination of many I/O pins and Stratix V GX family transceiver capabilities supports wide parallel and high‑speed interface requirements.
• Custom compute and acceleration  Deploy parallel hardware accelerators that leverage abundant logic and memory resources for throughput‑oriented tasks.
• Industrial systems  Industrial temperature rating and surface‑mount packaging make this device suitable for a range of industrial control and automation applications.

Unique Advantages

• High logic density: Approximately 340,000 logic elements provide headroom for large, integrated designs and complex state machines.
• Substantial on‑chip memory: Approximately 19.456 Mbits of embedded RAM reduces external memory dependence for buffering and local storage.
• Generous I/O count: 432 I/Os enable broad connectivity options for multi‑lane interfaces and numerous peripheral signals.
• Industrial temperature range: Rated from –40°C to 100°C for operation in thermally challenging environments.
• Compact FCBGA package: 1152‑BBGA (35×35) FCBGA footprint for dense PCB layouts and surface‑mount assembly.
• Regulatory and assembly readiness: RoHS compliance supports lead‑free manufacturing processes.

Why Choose 5SGXEA3K2F35I3L?

The 5SGXEA3K2F35I3L combines a large logic fabric, significant on‑chip RAM, and a high I/O count in a surface‑mount 1152‑BBGA package. Its industrial temperature rating and low core voltage range make it suitable for robust embedded and industrial designs that require dense programmable logic and local memory.

Choose this Intel Stratix V GX device when your design demands integrated capacity for complex digital functions, substantial embedded memory for data handling, and broad I/O connectivity while maintaining compliance with RoHS and industrial operating conditions.

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