5SGXEA3K2F35I3LN

The 5SGXEA3K2F35I3LN is a Stratix V GX Field Programmable Gate Array (FPGA) IC from Intel, delivering a high-density, reconfigurable logic fabric in a 1152‑ball BGA package. It combines a large logic element count with substantial on‑chip RAM and a broad I/O complement suited to industrial temperature deployments.

Designed for engineers who require a dense, configurable silicon platform, this device provides the core building blocks for custom digital systems where integration, flexibility, and thermal range are key considerations. Detailed electrical and switching characteristics are documented in the Stratix V device datasheet.

Key Features

• Logic Capacity — 340,000 logic elements (cells) to implement complex programmable logic and custom datapaths.
• Embedded Memory — Approximately 19.456 Mbits of on‑chip RAM for FIFOs, buffers, and local storage.
• I/O — 432 user I/O pins providing ample connectivity for high‑pin‑count designs.
• Package & Mounting — Supplied in a 1152‑BBGA (FCBGA) package; supplier device package listed as 1152‑FBGA (35×35). Surface mount mounting type.
• Power Supply — Core voltage supply range of 820 mV to 880 mV, enabling designers to plan power delivery precisely.
• Temperature Grade — Industrial grade device with an operating temperature range of −40 °C to 100 °C.
• Standards & Documentation — Device is RoHS compliant; comprehensive electrical and timing specifications are provided in the Stratix V device datasheet.

Typical Applications

• High‑density digital logic — Implement custom state machines, signal processing, and protocol logic using the device's large logic and memory resources.
• I/O‑rich systems — Use the 432 I/Os to interface with multiple peripherals, sensors, or parallel buses in industrial equipment.
• Industrial embedded systems — Deployable across −40 °C to 100 °C operating ranges for industrial automation and control where temperature resilience is required.

Unique Advantages

• High logic density: 340,000 logic elements allow consolidation of multiple functions into a single device, reducing BOM and board area.
• Substantial on‑chip memory: Approximately 19.456 Mbits of embedded RAM supports deep buffering and local data storage without external memory.
• Robust I/O count: 432 I/Os provide flexible connectivity for complex, multi‑interface designs.
• Industrial temperature rating: Specified for −40 °C to 100 °C operation to meet demanding environmental requirements.
• Compact, manufacturable package: 1152‑ball BGA (35×35) offers a high‑pin‑count solution in a surface‑mount form factor compatible with standard assembly processes.
• Documented electrical and timing data: Stratix V device datasheet contains the electrical and switching characteristics needed for system design and validation.

Why Choose 5SGXEA3K2F35I3LN?

The 5SGXEA3K2F35I3LN positions itself as a high‑capacity Stratix V GX FPGA for designers who need extensive programmable logic, significant embedded memory, and a large I/O footprint in an industrial temperature device. Its documented electrical characteristics and package options support integration into demanding embedded and industrial designs.

Choose this device when your design requires a scalable, reconfigurable platform backed by the Stratix V device documentation and Intel manufacturing pedigree, enabling longer‑term design confidence and supply continuity.

Request a quote or submit a pricing inquiry to evaluate the 5SGXEA3K2F35I3LN for your next design project.