5SGXEA3K2F40C2G

The 5SGXEA3K2F40C2G is an Intel Stratix V GX family FPGA delivered in a 1517-BBGA FCBGA package (1517-FBGA, 40×40) for surface-mount assembly. This commercial-grade FPGA provides a very high logic capacity, substantial on-chip memory, and a large I/O count for complex, programmable digital designs.

Designed for applications that require dense programmable logic and extensive I/O, the device offers a broad core voltage operating window (870 mV to 930 mV) and a commercial operating temperature range of 0 °C to 85 °C, making it suitable for standard enterprise and lab environments.

Key Features

• Large logic capacity — 340,000 logic elements to implement complex RTL, custom datapaths, and large state machines.
• Configurable logic blocks — 128,300 configurable logic blocks to structure large logic designs with hierarchical resources.
• Embedded memory — approximately 19.456 Mbits of on-chip RAM to store large datasets, buffers, and LUT-based structures without external memory.
• Extensive I/O — 696 device I/O pins to support wide parallel interfaces, multi-channel I/O arrays, and mixed-signal front-ends.
• Power and supply — core supply operating range from 870 mV to 930 mV for defined power-domain planning and core sequencing.
• Package and mounting — 1517-BBGA (1517-FBGA, 40×40) FCBGA package with surface-mount mounting for high-density board layouts.
• Commercial temperature grade — rated for operation from 0 °C to 85 °C for standard commercial applications.
• Environmental compliance — RoHS-compliant component for regulatory-aligned designs.

Typical Applications

• High-density digital processing — Implement complex algorithms and large logic networks using the device’s 340,000 logic elements and extensive on-chip RAM.
• Multi-channel I/O systems — Support wide parallel interfaces and numerous peripheral connections with 696 I/O pins.
• Prototyping and platform integration — Use the commercial-grade Stratix V GX device to validate advanced system architectures and integrate large FPGA subsystems.

Unique Advantages

• High logic and memory integration: Large counts of logic elements and approximately 19.456 Mbits of embedded RAM reduce the need for external logic and memory components.
• Broad I/O capacity: 696 device I/Os allow flexible interface options and simplify board-level routing for multi-channel designs.
• Defined power domain: A specified core voltage range (870 mV–930 mV) supports predictable power budgeting and sequencing.
• Commercial temperature support: Rated for 0 °C–85 °C operation to match typical enterprise and laboratory deployments.
• Standard FCBGA packaging: 1517-BBGA (1517-FBGA, 40×40) package enables high-density PCB integration in compact system footprints.
• RoHS-compliant: Helps meet environmental requirements for regulated markets and supply chains.

Why Choose 5SGXEA3K2F40C2G?

The 5SGXEA3K2F40C2G provides a high-capacity, commercially rated Stratix V GX FPGA platform that balances large programmable logic resources, significant embedded memory, and a high I/O count in a compact FCBGA package. It is well suited for engineering teams implementing complex digital processing, multi-interface systems, or platform-level FPGA integration where onboard resources and I/O density matter.

As part of the Stratix V family, this device aligns with available device-level documentation and family-level design references, supporting scalable board designs and predictable system-level integration.

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