5SGXEA3K2F40C2N

The 5SGXEA3K2F40C2N is a Stratix® V GX field programmable gate array (FPGA) in a 1517-ball FCBGA package from Intel. It provides a high logic capacity with extensive I/O and embedded memory, designed for applications that require large programmable logic fabrics and significant on-chip RAM.

With a reported 340,000 logic elements, approximately 19.46 Mbits of embedded memory, and 696 I/Os, this commercial-grade device addresses designs needing dense logic integration, substantial memory resources, and broad external connectivity while operating within a 0 °C to 85 °C range.

Key Features

• Logic Capacity  Approximately 340,000 logic elements to support large, complex FPGA designs.
• Embedded Memory  Approximately 19.46 Mbits of on-chip RAM for local data buffering, FIFO structures, and state storage.
• I/O Count  696 general-purpose I/Os to accommodate dense external interfacing and multi-channel connectivity.
• Package & Mounting  1517-BBGA (FCBGA) package, supplier device package 1517-FBGA (40×40); surface-mount device suitable for standard PCB assembly processes.
• Power  Core voltage operating range of 870 mV to 930 mV for the device core supply.
• Temperature & Grade  Commercial grade device rated for operation from 0 °C to 85 °C.
• Compliance  RoHS compliant.
• Stratix V GX Series Transceiver Capability (Series Reference)  The Stratix V GX family includes transceiver speed grades published up to 14.1 Gbps (series-level specification).

Typical Applications

• High-density logic systems  Large-scale programmable logic implementations that require hundreds of thousands of logic elements and substantial embedded RAM.
• Multi-channel I/O platforms  Designs that need hundreds of external interfaces or parallel I/O channels leveraging the device’s 696 I/Os.
• High-performance data processing  On-chip memory and logic capacity suited to data buffering, packet processing, and complex datapath implementations.

Unique Advantages

• High logic integration: 340,000 logic elements enable consolidation of multiple functions into a single device, reducing board-level component count.
• Substantial on-chip memory: Approximately 19.46 Mbits of embedded RAM supports local storage and high-throughput buffering without immediate external memory dependence.
• Extensive I/O resources: 696 I/Os provide flexibility for dense connectivity, multi-lane interfaces, and diverse peripheral attachments.
• Compact BGA packaging: 1517-ball FCBGA in a 40×40 supplier footprint allows high-pin-count routing in a compact form factor suitable for space-constrained PCBs.
• Commercial temperature rating: Rated 0 °C to 85 °C to match a broad range of controlled-environment electronics applications.
• RoHS compliant: Meets RoHS requirements for environmentally regulated designs.

Why Choose 5SGXEA3K2F40C2N?

The 5SGXEA3K2F40C2N positions itself as a high-capacity Stratix V GX FPGA option for designs that demand a large programmable fabric, significant embedded RAM, and a high count of external I/Os. Its commercial-grade temperature range and FCBGA package make it suitable for complex system designs where board space and integration density are important.

For teams targeting scalable, high-density FPGA implementations that leverage the Stratix V GX family characteristics, this device provides verifiable on-chip resources and packaging choices that support robust, compact hardware designs with long-term maintainability.

Request a quote or submit an inquiry for pricing and availability of the 5SGXEA3K2F40C2N to evaluate it for your next high-density FPGA design.