5SGXEA3K2F40C3

The 5SGXEA3K2F40C3 is a Stratix® V GX Field Programmable Gate Array (FPGA) from Intel, offering high-density programmable logic and substantial on-chip memory. Designed for commercial-grade applications, it provides a combination of large logic capacity, extensive I/O, and a compact FCBGA package for complex digital designs.

This device is part of the Stratix V family and is specified for a commercial operating temperature range and low-voltage core operation, making it suitable for advanced designs that require dense integration and significant embedded memory resources.

Key Features

• Logic Capacity  Approximately 340,000 logic elements and 128,300 logic blocks provide ample resources for wide-ranging programmable logic implementations.
• Embedded Memory  Approximately 19.456 Mbits of on-chip RAM to support large buffers, FIFOs, and state storage for complex designs.
• I/O Density  696 I/Os enable extensive peripheral interfacing and system-level connectivity without external multiplexing.
• Power and Core Supply  Core voltage supply range from 820 mV to 880 mV for the device core power rail.
• Package and Mounting  1517-BBGA FCBGA (supplier package: 1517-FBGA, 40×40) in a surface-mount format to support high-pin-count board designs.
• Operating Temperature  Commercial grade rated from 0 °C to 85 °C for typical commercial-environment deployments.
• Environmental Compliance  RoHS compliant for environmental and regulatory considerations.

Typical Applications

• High-density digital processing  Use the large logic element count and logic blocks for complex state machines, signal processing pipelines, and custom datapaths.
• Memory-rich designs  Leverage approximately 19.456 Mbits of embedded RAM for buffering, packet processing, and on-chip storage needs.
• Complex I/O systems  With 696 I/Os, integrate multiple peripherals, wide parallel interfaces, or numerous board-level signals directly to the FPGA.

Unique Advantages

• High integration density: The combination of ~340,000 logic elements and ~19.456 Mbits of RAM reduces external component count and simplifies system architecture.
• Large I/O budget: 696 I/Os allow direct connection to many peripherals and buses, minimizing additional interface circuitry.
• Compact high-pin-count package: The 1517-BBGA FCBGA (1517-FBGA, 40×40) delivers high interconnect density in a surface-mount form factor suitable for space-constrained boards.
• Commercial temperature suitability: Rated 0 °C to 85 °C for standard commercial deployments where consistent performance across typical ambient conditions is required.
• Low-voltage core operation: Core supply specified between 820 mV and 880 mV for designs targeting modern low-voltage power domains.
• Standards-based environmental compliance: RoHS compliance supports use in regulated product lines.

Why Choose 5SGXEA3K2F40C3?

The 5SGXEA3K2F40C3 delivers a balanced combination of high logic density, substantial embedded memory, and a large I/O count within a compact FCBGA package. It is positioned for commercial-grade designs that require extensive programmable resources and on-chip RAM without sacrificing pin count or board-area efficiency.

As a member of the Stratix V GX family, this device is suitable for engineers and teams building complex, memory-intensive digital systems who need a scalable, high-capacity FPGA solution backed by comprehensive device documentation.

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