5SGXEA3K2F40C2LN

The 5SGXEA3K2F40C2LN is a Stratix V GX FPGA optimized for high-density, high-bandwidth designs. As a Stratix V GX device, it combines a large logic fabric with extensive embedded memory and a high I/O count to address complex digital signal processing, protocol bridging, and system integration tasks.

Key value is delivered through a combination of 340,000 logic elements, approximately 19.456 Mbits of embedded memory, and up to 696 I/O pins, all in a 1517-ball FCBGA (40×40) surface-mount package. The device is commercial grade with an operating range of 0 °C to 85 °C and a documented core voltage range of 820 mV to 880 mV.

Key Features

• Core Logic  340,000 logic elements (cells) provide a large programmable fabric for complex logic, DSP, and control implementations.
• Embedded Memory  Approximately 19.456 Mbits of on-chip RAM to support buffering, FIFOs, and on-chip data storage without external memory for many functions.
• I/O Density  Up to 696 I/O pins enable extensive peripheral, memory, and multi-channel interfacing in high-pin-count systems.
• Transceiver Capability (Series Datasheet)  Stratix V GX family devices include transceiver speed grades documented in the datasheet, with GX channel speed grade listings up to 14.1 Gbps for applicable speed grades.
• Power and Core Voltage  Documented core supply voltage range of 820 mV to 880 mV to match system power planning and regulator design.
• Package and Mounting  1517-BBGA FCBGA (supplier package 1517-FBGA, 40×40) surface-mount package for high-density board integration.
• Commercial Temperature Grade  Rated for operation from 0 °C to 85 °C, suitable for commercial and many embedded applications.
• Environmental Compliance  RoHS compliant to meet standard environmental and manufacturing requirements.

Typical Applications

• High-Speed Data Processing  Large logic capacity and substantial embedded memory support complex DSP pipelines, packet processing, and real-time data manipulation.
• Multi-Channel I/O Systems  High I/O count enables integration of multiple interfaces, sensors, and peripherals on a single FPGA platform.
• Protocol Bridging and Interface Aggregation  Stratix V GX family transceiver speed grades (as documented in the device series datasheet) make the family suitable for designs requiring high-speed serial links alongside dense logic.

Unique Advantages

• High Logic Density:  340,000 logic elements let you consolidate complex functions into a single device, reducing system BOM and board area.
• Substantial On-Chip Memory:  Approximately 19.456 Mbits of embedded RAM reduces dependence on external memory for many buffering and state-storage needs.
• Extensive I/O:  Up to 696 I/Os simplify board-level routing and enable direct interfacing to many subsystems without additional multiplexing logic.
• Commercial Temperature Suitability:  Rated 0 °C to 85 °C for reliable operation in commercial environments and general embedded products.
• Surface-Mount FCBGA Package:  1517-ball FCBGA (40×40) allows high-density PCB integration while supporting the device’s high pin-count requirements.
• RoHS Compliant:  Meets common environmental compliance requirements for modern electronics manufacturing.

Why Choose 5SGXEA3K2F40C2LN?

The 5SGXEA3K2F40C2LN positions itself as a high-density Stratix V GX FPGA offering a balance of large logic capacity, significant embedded memory, and high I/O count in a compact FCBGA package. It is suited to teams building sophisticated data-paths, multi-channel interface controllers, and designs that benefit from on-chip memory and wide parallelism.

As a commercial-grade Stratix V GX device with a documented core voltage range and the series’ transceiver speed-grade information available in the datasheet, it supports robust design planning for performance-oriented embedded systems while maintaining standard manufacturing and environmental compliance.

Request a quote or submit an inquiry to receive pricing, lead-time, and availability information for the 5SGXEA3K2F40C2LN. Our team can provide the specific supply and ordering details you need to move your design forward.