5SGXEA3K2F40C3G

The 5SGXEA3K2F40C3G is a Stratix® V GX field-programmable gate array (FPGA) in a 1517-BBGA FCBGA package designed for commercial applications. It delivers high logic capacity, substantial embedded memory, and a large number of I/O channels for designs that require dense digital integration and extensive external connectivity.

Engineered for surface-mount assembly and RoHS-compliant manufacturing, this commercial-grade device operates from 820 mV to 880 mV core supply and across a 0 °C to 85 °C operating range.

Key Features

• High Logic Capacity — Approximately 340,000 logic elements provide large-scale programmable fabric for complex digital functions and system-level integration.
• Embedded Memory — Approximately 19.46 Mbits of on-chip RAM to support buffering, LUT-based storage, and memory-intensive logic blocks.
• Extensive I/O — 696 I/O pins enable high channel counts and broad peripheral connectivity for multi-lane interfaces and dense sensor or port aggregation.
• Package and Mounting — 1517-BBGA (FCBGA) package with supplier device package 1517-FBGA (40×40) in a surface-mount form factor for compact board integration.
• Low-Voltage Core — Core supply specified at 820 mV to 880 mV to match system power-rail planning and support targeted core-voltage designs.
• Commercial Temperature Grade — Rated for 0 °C to 85 °C operation, suitable for a wide range of commercial products and environments.
• Regulatory Compliance — RoHS-compliant to support lead-free manufacturing and regulatory requirements.

Typical Applications

• High-density digital processing — Implement complex state machines, data path logic, and custom compute pipelines using the device’s large pool of logic elements and embedded RAM.
• I/O-intensive systems — Aggregate and manage many external interfaces or sensor arrays using the 696 available I/Os for high-channel connectivity.
• Prototyping and system validation — Validate system architectures and perform hardware/software co-design where significant on-chip logic and memory resources are required.
• Compact board designs — Use the 1517-BBGA FCBGA surface-mount package to integrate high-capacity FPGA functionality within constrained PCB footprints.

Unique Advantages

• High integration density: Approximately 340,000 logic elements reduce the need for multiple devices, simplifying system architecture and lowering component count.
• Substantial on-chip RAM: Approximately 19.46 Mbits of embedded memory supports buffering and local data storage without external memory dependency.
• Large I/O budget: 696 I/Os enable multi-port interfaces and parallel connectivity, improving system throughput and flexibility.
• Compact FCBGA mounting: The 1517-BBGA package in a 40×40 supplier footprint allows integration into space-constrained boards while maintaining thermal and electrical performance.
• Commercial-ready operating range: Specified 0 °C to 85 °C operation and RoHS compliance help streamline qualification for commercial products.
• Predictable power planning: Core supply range of 820 mV to 880 mV supports precise power-supply design and system-level power budgeting.

Why Choose 5SGXEA3K2F40C3G?

The 5SGXEA3K2F40C3G positions itself as a high-capacity, commercial-grade Stratix V GX FPGA suited for designs that demand substantial programmable logic, significant on-chip RAM, and a high I/O count in a compact FCBGA package. Its defined core voltage range and commercial temperature rating make it appropriate for mainstream electronic products requiring reliable FPGA resources.

This device is appropriate for engineering teams developing complex digital systems, dense I/O subsystems, or prototypes that benefit from a single, highly integrated FPGA solution. The combination of logic capacity, embedded memory, and packaging supports scalable designs and streamlined PCB integration.

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