5SGXEA3K2F40C3W

The 5SGXEA3K2F40C3W is an Intel Stratix® V GX field programmable gate array (FPGA) in a 1517-BBGA FCBGA package. It delivers a large programmable fabric with 340,000 logic elements and substantial on-chip memory, designed for high-density digital logic, complex signal processing, and I/O‑heavy designs.

This commercial-grade device is offered in a surface-mount 1517-FBGA (40×40) supplier package, operates from a core supply of 820 mV to 880 mV, and supports operating temperatures from 0 °C to 85 °C—providing a combination of integration density and system-level interfacing for demanding embedded and communication applications.

Key Features

• Programmable Fabric  Approximately 340,000 logic elements to implement complex custom logic, signal processing blocks, and control functions.
• Embedded Memory  Approximately 19.456 Mbits of on-chip RAM for buffering, lookup tables, and shared data storage.
• High I/O Count  696 user I/Os to support extensive peripheral, interface, and bus connectivity requirements.
• Power  Core voltage supply range of 820 mV to 880 mV to match system power-rail requirements and design choices.
• Package & Mounting  1517-BBGA (FCBGA) package; supplier device package listed as 1517-FBGA (40×40). Surface-mount mounting type for standard PCB assembly.
• Temperature & Grade  Commercial grade with an operating temperature range of 0 °C to 85 °C suitable for controlled-environment electronics.
• Regulatory  RoHS compliant.

Typical Applications

• High-density digital signal processing  Use the large logic element count and embedded RAM for DSP pipelines, filtering, and real‑time processing tasks.
• Communications & networking infrastructure  Leverage the high I/O count to aggregate interfaces, implement protocol engines, and manage packet processing.
• High-performance prototyping  Implement complex SoC emulation, hardware acceleration, and system-level validation with the device’s large FPGA fabric.

Unique Advantages

• Large programmable capacity: The approximately 340,000 logic elements provide headroom for sizable FPGA designs without immediate upscaling.
• Significant embedded memory: Approximately 19.456 Mbits of on-chip RAM reduces external memory dependence for buffering and state storage.
• Extensive system I/O: 696 I/Os enable broad interfacing options for peripherals, transceivers, and multi-board systems.
• Compact, production-ready package: 1517-FBGA (40×40) surface-mount package supports standard PCB assembly and thermal planning.
• Commercial temperature suitability: Rated for 0 °C to 85 °C operation for use in controlled-environment electronics and equipment.
• Manufacturer pedigree: Part of the Intel Stratix V GX family and documented in the Stratix V device datasheet.

Why Choose 5SGXEA3K2F40C3W?

The 5SGXEA3K2F40C3W balances large programmable logic capacity, substantial embedded memory, and a high I/O count in a production-ready FCBGA package—making it well suited for designers building complex digital systems, communication platforms, and hardware-accelerated solutions. Its commercial-grade operating range and RoHS compliance align with many controlled-environment electronics programs.

As a member of the Stratix V GX family from Intel, this device provides a scalable option within the Stratix V device lineup for teams that need dense logic resources, significant on-chip RAM, and broad system interfacing in a single FPGA component.

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