5SGXEA3K2F40I2G

IC FPGA 696 I/O 1517FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 696 19456000 340000 1517-BBGA, FCBGA

Quantity 352 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package1517-FBGA (40x40)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1517-BBGA, FCBGANumber of I/O696Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs128300Number of Logic Elements/Cells340000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits19456000

Overview of 5SGXEA3K2F40I2G – Stratix V GX FPGA, 340,000 logic elements, 1517-FBGA

The 5SGXEA3K2F40I2G is a Stratix® V GX Field Programmable Gate Array (FPGA) device that delivers large programmable logic capacity, abundant embedded memory, and extensive I/O in a 1517-ball FCBGA package. It is a member of the Stratix V GX family and is characterized by the device-level electrical and switching specifications documented for the Stratix V series.

This device is suited to designs that require high logic density, significant on-chip RAM, and robust industrial-temperature operation. Its combination of logic resources, embedded memory and multi-hundred I/O count supports complex FPGA-based processing, interface, and system integration tasks.

Key Features

  • Logic Fabric Approximately 340,000 logic elements across 128,300 logic blocks, providing large on-device programmable logic capacity for complex designs.
  • Embedded Memory Approximately 19.456 Mbits of on-chip RAM for buffer, FIFO and local data storage requirements.
  • I/O Density 696 general-purpose I/O pins to support wide parallel interfaces and multiple high-pin-count peripherals.
  • Transceiver Capability (Family) Stratix V GX devices include GX transceiver speed grades (family documentation lists GX channel offerings up to 14.1 Gbps), enabling high-speed serial links where required.
  • Power and Core Voltage Core supply range specified at 870 mV to 930 mV for precise power management and system design.
  • Package and Mounting 1517-ball BGA (FCBGA) package; supplier device package listed as 1517-FBGA (40×40). Surface-mount device.
  • Industrial Temperature Grade Rated for operation from –40 °C to 100 °C, suitable for industrial temperature environments.
  • Regulatory RoHS compliant.

Typical Applications

  • High‑performance signal processing Large logic capacity and ~19.456 Mbits of embedded memory enable implementation of complex DSP pipelines and buffering functions on-chip.
  • High‑speed communications Support for Stratix V GX transceiver speed grades (family-level specifications) and extensive I/O make this device suitable for networking and serial link applications.
  • Interface bridging and aggregation With 696 I/Os, the device is appropriate for aggregating multiple parallel interfaces and acting as a protocol bridge in dense I/O systems.
  • Industrial control and automation Industrial temperature rating and robust packaging support deployment in factory and industrial systems requiring large programmable logic capacity.

Unique Advantages

  • Large on-chip logic capacity: Approximately 340,000 logic elements allow integration of complex functions and system-level consolidation onto a single FPGA.
  • Substantial embedded memory: Approximately 19.456 Mbits of RAM reduces external memory dependency for many buffering and data‑path needs.
  • Extensive I/O count: 696 I/Os enable high-pin-count interfacing without external expanders, simplifying board-level design.
  • Industrial temperature support: Rated from –40 °C to 100 °C for deployment in industrial environments where extended temperature operation is required.
  • Documented family-level transceiver support: Stratix V GX family transceiver grades are specified in the device documentation, allowing architecting of high-speed serial links when needed.
  • RoHS compliant packaging: Environmentally compliant materials and standard FCBGA packaging for surface-mount assembly.

Why Choose 5SGXEA3K2F40I2G?

The 5SGXEA3K2F40I2G provides a combination of high logic density, significant embedded RAM and large I/O capacity in a packaged Stratix V GX device rated for industrial temperatures. It is positioned for designs that require consolidated programmable logic, on-chip memory for data handling, and the ability to support high-speed serial interfaces as defined by Stratix V GX family documentation.

This device is appropriate for engineering teams building complex FPGA-based systems where on-device resources and industrial temperature operation are essential. The Stratix V GX family electrical and switching characteristics are documented for system-level integration and reliable deployment.

Request a quote or submit an inquiry to receive pricing and availability details for the 5SGXEA3K2F40I2G.

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