5SGXEA3K2F40I2N

The 5SGXEA3K2F40I2N is an Intel Stratix V GX Field Programmable Gate Array (FPGA) in a 1517-BBGA (FCBGA) package. This industrial-grade device provides a large logic fabric, substantial on-chip memory, and a high I/O count for complex system integration under extended temperature conditions.

Designed for demanding industrial deployments, the device combines approximately 340,000 logic elements with roughly 19.46 Mbits of embedded memory and up to 696 I/Os, enabling dense digital logic implementations and extensive peripheral interfacing.

Key Features

• Core Logic  Approximately 340,000 logic elements for implementing large-scale RTL, custom accelerators, and complex control logic.
• Embedded Memory  Approximately 19.46 Mbits of on-chip RAM for buffering, packet storage, and local data processing.
• I/O Density  696 I/O pins to accommodate high-pin-count interfaces and multiple peripheral connections.
• Package & Mounting  1517-BBGA (FCBGA) package, supplier device package 1517-FBGA (40×40), surface-mount mounting type for compact board-level integration.
• Power Supply  Core voltage supply range of 870 mV to 930 mV to match modern low-voltage system domains.
• Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
• RoHS Compliant  Meets RoHS requirements for lead-free manufacturing processes.

Typical Applications

• High-density logic designs  Systems that require approximately 340,000 logic elements and substantial on-chip memory for complex digital processing.
• Industrial control and automation  Deployments benefiting from the −40 °C to 100 °C operating range and industrial-grade classification.
• High I/O system integration  Applications that need up to 696 I/Os for connecting multiple sensors, interfaces, or subsystems.

Unique Advantages

• High integration density: Large logic element count and ~19.46 Mbits of embedded RAM reduce the need for external logic and memory, simplifying BOM and board space.
• Extensive I/O capability: 696 I/Os enable broad connectivity options for complex multi-interface designs and high-channel-count systems.
• Industrial readiness: Industrial temperature rating (−40 °C to 100 °C) supports reliable operation in harsh or temperature-variable environments.
• Compact package format: 1517-BBGA (40×40) FCBGA package provides a compact surface-mount solution for space-constrained applications.
• Modern core voltage: 870–930 mV supply range aligns with contemporary low-voltage system domains.
• Standards-friendly manufacturing: RoHS compliance supports industry-standard, lead-free production processes.

Why Choose 5SGXEA3K2F40I2N?

The 5SGXEA3K2F40I2N delivers the combined attributes of high logic density, sizable on-chip memory, and a large I/O complement in an industrial-grade Stratix V GX FPGA package. These characteristics make it suitable for engineers and system designers implementing dense digital logic, memory-intensive functions, and complex I/O topologies in industrial settings.

Backed by Intel Stratix V family documentation, this device offers a clear specification set—core voltage range, operating temperature, package type, and compliance—that supports predictable integration, procurement planning, and long-term project deployment.

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