5SGXEA3K2F40I3G

The 5SGXEA3K2F40I3G is a Stratix V GX field programmable gate array (FPGA) IC in a 1517‑BBGA (1517‑FBGA 40×40) package. It delivers a high logic capacity and abundant I/O with on‑chip embedded memory, and is offered in an industrial temperature grade.

This device targets designs that require large programmable logic resources, substantial embedded RAM, and a large number of I/O pins while operating across a wide temperature and core‑voltage range.

Key Features

• Logic Capacity — 340,000 logic elements (cell count reported in product data) to implement large, complex digital designs.
• Logic Array Blocks — 128,300 logic array blocks, providing structured building blocks for synthesis and placement.
• Embedded Memory — Approximately 19.456 Mbits of on‑chip RAM for buffering, FIFOs, and on‑device data storage.
• I/O Count — 696 I/O pins to support dense external interfaces and parallel buses.
• Power and Core Voltage — Specified core supply range of 820 mV to 880 mV for the device core voltage domain.
• Package and Mounting — 1517‑BBGA (FCBGA) package, supplier device package 1517‑FBGA (40×40); surface mount mounting type for standard PCB assembly.
• Temperature Grade — Industrial grade with operating range from –40 °C to 100 °C.
• Standards Compliance — RoHS compliant as stated in the product data.
• Family Transceiver Capability (family data) — The Stratix V GX family supports multiple transceiver speed grades across commercial and industrial offerings (family specifications described in the datasheet).

Typical Applications

• High‑density digital processing — Implement complex RTL, datapaths, and custom hardware accelerators using the device's large logic and memory resources.
• Multi‑interface bridging — Use the high I/O count to connect multiple parallel and serial interfaces in a single FPGA solution.
• Platform and subsystem integration — Consolidate multiple functions (control, protocol handling, buffering) onto one device to reduce external components.

Unique Advantages

• Extensive logic resources: 340,000 logic elements allow substantial integration of logic functions on a single device, reducing system complexity.
• Significant on‑chip memory: Approximately 19.456 Mbits of embedded RAM supports large buffering and state storage without external memory.
• High I/O density: 696 I/O pins enable broad connectivity to peripherals, sensors, and high‑pin‑count interfaces.
• Industrial temperature operation: Rated from –40 °C to 100 °C for deployment in temperature‑sensitive environments.
• Industry compliance: RoHS compliance supports environmentally preferable assembly and production processes.
• Robust packaging: 1517‑BBGA FCBGA package supports surface‑mount assembly for compact board layouts.

Why Choose 5SGXEA3K2F40I3G?

The 5SGXEA3K2F40I3G combines a high count of logic elements, substantial embedded RAM, and a large I/O complement in an industrial‑grade Stratix V GX FPGA package. It is suited for engineers and system architects who need to consolidate complex logic, memory buffering, and dense external connectivity into a single, RoHS‑compliant device while operating across a wide temperature and core‑voltage range.

Selecting this part leverages the Stratix V family’s documented electrical and transceiver capabilities (as described in the available device datasheet) and provides a scalable platform for demanding FPGA implementations.

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